Solid-cryogen encapsulation system

Abstract

A solid-cryogen encapsulation system includes a cryogen source, a container, and a cooling system. The container is coupled to receive liquid cryogen supplied by the cryogen source. The container includes a freezing compartment, a cover, and a conduit. The freezing compartment has an opening through which a mold structure is temporarily received. The mold structure includes a device suspended within an interior cavity of the mold structure. The cover is configured to selectively close the opening and seal the freezing compartment, where the conduit is within the freezing compartment and fills the interior cavity of the mold structure with the liquid cryogen to submerge the device. The cooling system is coupled to the container to freeze the liquid cryogen within the interior cavity of the mold structure to encapsulate the device in a solid cryogen.

Dependencies are inferred from the claim text.