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US 4,470,786 AGranted
Molding apparatus with retractable preform support pins
AssigneeOmron Tateisi Electronics Co.
InventorsTakezo Sano, Kenichi Tsuruyoshi
Life of this patent
Estimating the term…
Abstract
A molding method and apparatus in which an insert part is supported in a mold cavity by a pin. The pin is withdrawn when the resin pressure in the mold exceeds a predetermined value.
Claims1
A molding apparatus comprising:
- a metal mold having upper and lower parts defining therebetween a mold cavity for receiving a resin;
- first and second pins extending into said cavity for supporting an insert part in said cavity;
- means urging said pin into said cavity including a backing plate mounted in a chamber adjacent said cavity and having a first surface engaging said pins and an opposed inclined surface;
- a pressure sensor for detecting the pressure in said cavity and having a portion in communication with said cavity;
- means engaging said pin for causing withdrawal of said pins when the detected pressure exceeds a predetermined value including at least one spring urging said backing plate in a direction to withdraw said pins from said cavity, a sliding plate having an inclined surface in contact with said inclined surface of said backing plate and means for moving said plate in a transverse direction to withdraw said pins from said cavity when said detected pressure exceeds said predetermined value.
2 more elements
Dependencies are inferred from the claim text.