B29C 2045/0036
Submerged or recessed burrs
Official title: {Submerged or recessed burrs}
B29C2045/0036 (Submerged or recessed burrs) appears on 28 US grants and 29 published applications in this corpus.
Search patents in B29C- Granted patents
- 28
- Published applications
- 29
- Assignees
- 31
- Inventors
- 81
- Latest grant
- 16 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 1 | 2 |
| 2005 | 2 | 3 |
| 2006 | 2 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 0 | 4 |
| 2012 | 0 | 2 |
| 2013 | 3 | 0 |
| 2014 | 1 | 2 |
| 2015 | 1 | 0 |
| 2016 | 1 | 2 |
| 2017 | 1 | 2 |
| 2018 | 2 | 2 |
| 2019 | 0 | 2 |
| 2020 | 3 | 1 |
| 2021 | 0 | 0 |
| 2022 | 2 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Biocompatible and/or food-safe tube assembly16 Sep 2025US 12,416,380 B2Raumedic AG
- Light system including a lens texture shutoff18 Oct 2022US 11,473,747 B1Valeo North America, Inc.
- Electronic module with a groove and press hole on the surface of a conductor18 Jan 2022US 11,227,810 B2Shindengen Electric Manufacturing Co., Ltd.
- Resin filling method and resin filling device for magnet embedded core22 Dec 2020US 10,873,249 B2Kuroda Precision Industries Ltd.
- Molding method and molding die for molded article21 Jul 2020US 10,717,219 B2Nok Corporation
- Biocompatible and/or food-safe tube assembly14 Mar 2024US 2024/0084943 A1Raumedic AG
- Electronic module22 Oct 2020US 2020/0335412 A1Shindengen Electric Manufacturing Co., Ltd.
- Manufacturing method for connecter housing28 Nov 2019US 2019/0363474 A1Toyota Jidosha Kabushiki Kaisha
- Rotor, electric motor, air conditioner, and method for manufacturing rotor23 May 2019US 2019/0157951 A1Mitsubishi Electric Corporation
- Injection Molded Seal Rings and Methods for Making Them12 Jul 2018US 2018/0195617 A1Saint-Gobain Performance Plastics L+S GmbH
Most cited
By later US patents
- Semiconductor device packaged in plastic and mold employable for production thereof22US 5,998,877 AOki Electric Industry Co., Ltd. · 1999
- Syringe plunger rod and method of manufacture15US 6,494,866 B1Owens-Illinois Closure Inc. · 2002
- Method of encapsulating a substrate-based package assembly without causing mold flash8US 6,635,209 B2Siliconware Precision Industries Co., Ltd. · 2003
- Molded lens having an outer circumference and first and second optical surfaces with cut off peripheral portions, and molding die for the molded lens8US 7,151,640 B2Konica Minolta Holdings, Inc. · 2006
- Method and apparatus for molding module electronic devices and a module electronic device molded thereby8US 7,166,909 B2Sony Corporation · 2007