Semiconductor device packaged in plastic and mold employable for production thereof

A mold for forming a plastic body around a semiconductor chip for a semiconductor device, the mold comprising:

• a lower mold having a cavity in a inside surface for holding a semiconductor chip;
• and
• an upper mold having a patterned surface including a plurality of projections having a non-flat shape in a cross-section thereof,
• wherein the projections are spaced apart a distance substantially equal to a cross sectional thickness of leads attached to the semiconductor chip, and
• wherein each of the plurality of projections longitudinally contacts each adjacent pair of the leads and extends downward between each adjacent pair of the leads when the chip is disposed in the cavity of the inside surface and the patterned surface of the upper mold is closed down on the lower mold.

A semiconductor device comprising:

• a semiconductor chip with a principal surface having a plurality of electrodes;
• a plurality of leads, each having a first portion in contact with the principal surface and electrically connected to the electrodes, a second portion disposed a distance from the principal surface, and a third portion connected to the first portion and the second portion;
• and
• plastic packaging material packaging the principal surface, the first portion, the second portion, and the third portion, leaving part of the second portions of the leads exposed, the plastic packaging material having a top surface, recesses from the top surface of the plastic packaging material being formed in the plastic packaging material between adjacent pairs of second portions of the leads.

A semiconductor device comprising:

• a semiconductor chip with a principal surface having a plurality of contact pads;
• a plurality of leads spaced apart from each other, each lead including a first segment in contact with the principal surface at a lead portion of the principal surface and electrically connected to a respective one of the plurality of contact pads, a second segment connected to the first segment at one end and spaced apart from the principal surface at an opposite end, and a third segment connected to the opposite end and substantially parallel to the principal surface having an upper face facing away from the principal surface, the upper face being provided at an upper lead height above the principal surface;
• and
• plastic packaging material in contact with the leads and in contact with the principal surface only outside the lead portion thereof, the plastic packaging material having an upper surface, the upper surface having gap portions between each pair of adjacent third segments, each gap portion having a non-flat shape and being recessed below the upper surface.

A semiconductor device comprising:

• a semiconductor chip with a principal surface having a plurality of electrodes;
• a plurality of leads, each having a first portion in contact with the principal surface and electrically connected to the electrodes, a second portion disposed a distance from the principal surface, and a third portion connected to the first portion and the second portion;
• and
• plastic packaging material packaging the principal surface, the first portion, the second portion, and the third portion, leaving part of the second portions of the leads exposed, the plastic packaging material having an upper surface, recesses in the upper surface of the plastic packaging material being formed in the plastic packaging material between adjacent pairs of second portions of the leads.