B24B 49/183
Wear compensation without the presence of dressing tools
Official title: {Wear compensation without the presence of dressing tools}
B24B49/183 (Wear compensation without the presence of dressing tools) appears on 54 US grants and 36 published applications in this corpus.
Search patents in B24B- Granted patents
- 54
- Published applications
- 36
- Assignees
- 46
- Inventors
- 113
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 5 |
| 2003 | 3 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 4 |
| 2015 | 1 | 0 |
| 2016 | 0 | 2 |
| 2017 | 1 | 1 |
| 2018 | 2 | 0 |
| 2019 | 2 | 4 |
| 2020 | 0 | 3 |
| 2021 | 0 | 1 |
| 2022 | 2 | 1 |
| 2023 | 3 | 4 |
| 2024 | 1 | 1 |
| 2025 | 2 | 3 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for conducting an abrasive operation in an additive manufacturing process2 Jun 2026US 12,643,196 B2Saint-Gobain Abrasives, Inc.
- In-situ grinding wheel topography, power monitoring, and feed/speed scheduling systems and methods31 Mar 2026US 12,589,459 B2Rtx Corporation
- Device and method for providing a suggestion for the optimal adjustment of a sheet metal working machine10 Mar 2026US 12,569,901 B2Arku Maschinebau GmbH
- Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same16 Sep 2025US 12,415,248 B2Samsung Electronics Co., Ltd.
- Method of helical chamfer machining silicon wafer7 Jan 2025US 12,191,152 B2Sumco Corporation
- Systems and methods for measuring a size of a cutting wheel11 Jun 2026US 2026/0158613 A1
- Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same27 Nov 2025US 2025/0360595 A1Samsung Electronics Co., Ltd.
- Method for manufacturing an ophthalmic device comprising machining9 Oct 2025US 2025/0312878 A1Essilor International
- Polishing system and method of polishing a component15 May 2025US 2025/0153308 A1ROLLS-ROYCE plc
- Robotic polishing system and method for using same27 Jun 2024US 2024/0208004 A1Pratt & Whitney Canada Corp.
Most cited
By later US patents
- Micromachining system108US 6,553,880 B2Sarcos LC · 2003
- Method to hone curved and shaped profiles and honing machine to carry out such method51US 5,613,894 ADelle Vedove Levigatrici SpA · 1997
- Method and apparatus of monitoring polishing pad wear during processing46US 6,045,434 AInternational Business Machines Corporation · 2000
- Semiconductor wafer dicing method42US 5,718,615 A1998
- Centerless grinding machine36US 4,570,387 AToyoda Koki Kabushiki Kaisha · 1986