Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same

A semiconductor fabrication method, comprising:

• preparing a substrate;
• placing the substrate into a substrate polishing apparatus;
• rotating each of the substrate and a polishing pad of the substrate polishing apparatus;
• and
• allowing a bottom surface of the substrate to contact a top surface of the polishing pad,
• wherein the allowing the bottom surface of the substrate to contact the top surface of the polishing pad includes allowing that, in a polishing location, the bottom surface of the substrate is polished while being in contact with the top surface of the polishing pad,
• wherein the polishing pad includes,
• a disk-shaped central region that includes a central point of the top surface of the polishing pad, and
• a plurality of annular regions that surround the central region and are homocentric with the central point,
• wherein, among the plurality of annular regions that overlap a portion of the polishing location when viewed in plan, a width in a radius direction of an outer overlapping section where an outer annular region overlaps the polishing location is less than a width in a radius direction of each of other annular regions that overlap the polishing location, the outer annular region being an outermost one of the plurality of annular regions that overlap a portion of the polishing location,
• wherein the substrate polis apparatus includes
• polishing head supporting the substrate,
• a stage opposite the polishing head, and
• the stage supporting the polishing pad.