Polishing system and method of polishing a component

A method of polishing a component, the method comprising the steps of:

• providing a polishing device including a housing, a polishing tool interchangeably coupled with the housing, and at least one pressure applicator disposed within the housing and configured to apply a pressure on the polishing tool to engage the polishing tool with the component;
• interchangeably coupling a holder with the housing of the polishing device to position the polishing device relative to the component;
• transmitting, by a controller, a control signal to the at least one pressure applicator to apply a predetermined amount of pressure on the polishing tool;
• applying, by the at least one pressure applicator, the predetermined amount of pressure on the polishing tool to engage the polishing tool with the component;
• and
• polishing an outer surface of the component based on the engagement of the polishing tool with the component;
• the method further comprising:
• generating, by a pressure sensor disposed within the housing, a pressure signal indicative of an amount of pressure being applied by the at least one pressure applicator and the holder on the polishing tool, wherein the pressure sensor is communicably coupled with the controller;
• and
• generating, by a component monitoring device, a process signal indicative of a material removal rate from the component, wherein the component monitoring device is communicably coupled with the controller.