B24B 1/04
Subjecting the grinding or polishing tools, the abrading or polishing medium or
Official title: subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00)
B24B1/04 (Subjecting the grinding or polishing tools, the abrading or polishing medium or) appears on 252 US grants and 226 published applications in this corpus.
Search patents in B24B- Granted patents
- 252
- Published applications
- 226
- Assignees
- 205
- Inventors
- 745
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 3 | 0 |
| 1998 | 7 | 0 |
| 1999 | 11 | 0 |
| 2000 | 12 | 0 |
| 2001 | 13 | 1 |
| 2002 | 11 | 13 |
| 2003 | 10 | 9 |
| 2004 | 3 | 8 |
| 2005 | 8 | 6 |
| 2006 | 7 | 6 |
| 2007 | 4 | 19 |
| 2008 | 4 | 8 |
| 2009 | 6 | 13 |
| 2010 | 7 | 10 |
| 2011 | 12 | 8 |
| 2012 | 4 | 3 |
| 2013 | 3 | 6 |
| 2014 | 5 | 6 |
| 2015 | 4 | 11 |
| 2016 | 7 | 7 |
| 2017 | 5 | 5 |
| 2018 | 7 | 10 |
| 2019 | 7 | 11 |
| 2020 | 11 | 12 |
| 2021 | 6 | 12 |
| 2022 | 3 | 9 |
| 2023 | 6 | 10 |
| 2024 | 9 | 7 |
| 2025 | 9 | 10 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conditioner and chemical mechanical polishing apparatus including the same6 Oct 2026US 12,752,393 B2Samsung Electronics Co., Ltd.
- Method and assembly for slurry delivery and utilization during ultrasonic impact grinding18 Aug 2026US 12,708,975 B2Rtx Corporation
- Multi-tip tooling design for ultrasonic impact grinding of CMCs10 Feb 2026US 12,544,875 B2Rtx Corporation
- Adaptive vibration amplitude for impact grinding of ceramic matrix composite components13 Jan 2026US 12,521,842 B2Rtx Corporation
- Gettering layer forming device and processing apparatus16 Dec 2025US 12,496,674 B2Disco Corporation
- Chemical mechanical polishing apparatus30 Jul 2026US 2026/0216843 A1Samsung Electronics Co., Ltd.
- Method and device for producing a modified surface structure on a tooth flank23 Jul 2026US 2026/0208313 A1Reishauer AG
- Spindle System With an Induction Element Integrated Into the Clamping Section of the Tool Holder25 Jun 2026US 2026/0175336 A1DMG MORI Ultrasonic Lasertec GmbH
- Method and device for dimensional restoration of a component of gas turbine engine via ultrasonic shot peening25 Jun 2026US 2026/0175363 A1Rtx Corporation
- Multi-tip tooling design for ultrasonic impact grinding of cmcs21 May 2026US 2026/0138232 A1Rtx Corporation
Most cited
By later US patents
- Manual tool for removing material from brittle and/or non-ductile stock416US 5,733,074 AHilti Aktiengesellschaft · 1998
- Spindle structure in ultrasonic machine and supporting horn used in the same379US 6,762,535 B2Takesho Co., Ltd. · 2004
- Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers166US 5,245,790 ALSI Logic Corporation · 1993
- Slurry polisher using ultrasonic agitation146US 5,245,796 AAT&T Bell Laboratories · 1993
- Method and apparatus for planarizing microelectronic substrates and conditioning planarizing media113US 6,083,085 AMicron Technology, Inc. · 2000