B23K 35/34
Comprising compounds which yield metals when heated
Official title: comprising compounds which yield metals when heated
B23K35/34 (Comprising compounds which yield metals when heated) appears on 126 US grants and 119 published applications in this corpus.
Search patents in B23K- Granted patents
- 126
- Published applications
- 119
- Assignees
- 87
- Inventors
- 305
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 7 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 4 |
| 2002 | 0 | 2 |
| 2003 | 3 | 3 |
| 2004 | 2 | 11 |
| 2005 | 5 | 9 |
| 2006 | 3 | 4 |
| 2007 | 1 | 4 |
| 2008 | 4 | 6 |
| 2009 | 1 | 6 |
| 2010 | 5 | 6 |
| 2011 | 2 | 2 |
| 2012 | 3 | 5 |
| 2013 | 4 | 5 |
| 2014 | 4 | 7 |
| 2015 | 5 | 16 |
| 2016 | 1 | 1 |
| 2017 | 6 | 5 |
| 2018 | 9 | 5 |
| 2019 | 5 | 3 |
| 2020 | 4 | 1 |
| 2021 | 3 | 0 |
| 2022 | 0 | 3 |
| 2023 | 3 | 2 |
| 2024 | 2 | 3 |
| 2025 | 4 | 4 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for low-manganese welding alloys2 Sep 2025US 12,403,551 B2Hobart Brothers Company
- Systems and methods for low-manganese welding alloys12 Aug 2025US 12,383,988 B2Hobart Brothers Company
- Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body1 Jul 2025US 12,343,820 B2Kabushiki Kaisha Toshiba
- Welding method for high-strength welding wire based on nanoparticle implantation and trace element compensation25 Mar 2025US 12,257,651 B2Nanjing University of Aeronautics and Astronautics
- Systems and methods for low-manganese welding alloys5 Nov 2024US 12,134,147 B2Hobart Brothers Company
- Systems and methods for photonic crystal integration13 Aug 2026US 2026/0233347 A1Mesodyne Inc.
- Nano-silver bonding paste and low-temperature sintering process using the same16 Jul 2026US 2026/0200017 A1KOSEMI Materials Limited
- Systems and methods for low-manganese welding alloys11 Dec 2025US 2025/0375842 A1Hobart Brothers Company
- Oxide-containing plate-shaped copper particle, paste composition, semiconductor device, electrical component and electronic component3 Jul 2025US 2025/0214180 A1KYOCERA Corporation
- Copper particle and method for producing same, paste composition, semiconductor device, electrical component, and electronic component26 Jun 2025US 2025/0205831 A1KYOCERA Corporation
Most cited
By later US patents
- Joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal137US 5,354,623 ACook Incorporated · 1994
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003
- Low temperature reactive bonding79US 5,381,944 AThe Regents of the University of California · 1995
- Freestanding reactive multilayer foils60US 6,736,942 B2The Johns Hopkins University · 2004
- Circuit board to be precoated with solder layers and solder circuit board53US 5,453,582 AFurukawa Electric Co., Ltd. · 1995