B23K 26/0869
Devices involving movement of the laser head in at least one axial
Official title: {Devices involving movement of the laser head in at least one axial direction}
B23K26/0869 (Devices involving movement of the laser head in at least one axial) appears on 1,414 US grants and 2,014 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,414
- Published applications
- 2,014
- Assignees
- 820
- Inventors
- 3,950
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 19 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 12 | 0 |
| 1992 | 10 | 0 |
| 1993 | 11 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 9 | 2 |
| 2002 | 14 | 23 |
| 2003 | 20 | 12 |
| 2004 | 20 | 26 |
| 2005 | 10 | 43 |
| 2006 | 19 | 37 |
| 2007 | 15 | 51 |
| 2008 | 16 | 47 |
| 2009 | 15 | 43 |
| 2010 | 29 | 49 |
| 2011 | 33 | 41 |
| 2012 | 40 | 39 |
| 2013 | 35 | 56 |
| 2014 | 39 | 52 |
| 2015 | 36 | 77 |
| 2016 | 40 | 94 |
| 2017 | 49 | 117 |
| 2018 | 61 | 136 |
| 2019 | 116 | 174 |
| 2020 | 122 | 151 |
| 2021 | 110 | 157 |
| 2022 | 114 | 132 |
| 2023 | 105 | 161 |
| 2024 | 82 | 119 |
| 2025 | 90 | 95 |
| 2026 | 51 | 80 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Laser processing device and laser processing method using same6 Oct 2026US 12,752,373 B2Panasonic Intellectual Property Management Co., Ltd.
- Laser processing apparatus for performing desired processing on a workpiece29 Sep 2026US 12,746,617 B2Disco Corporation
- Laser welding apparatus and method of controlling the same8 Sep 2026US 12,728,480 B2SK On Co., Ltd.
- Laser processing machine, laser processing system, rotator unit apparatus, laser processing method, and method for producing probe card1 Sep 2026US 12,722,228 B2Nittoku Kyoto Co., Ltd.
- Apparatus and method for cutting opening from workpiece25 Aug 2026US 12,715,064 B2ABB Schweiz AG
- Laser cutting installation1 Oct 2026US 2026/0295726 A1Fagor Arrasate, S. Coop.
- Optical fiber etching device1 Oct 2026US 2026/0295727 A1WuHan Raycus Fiber Laser Technologies CO., LTD
- Method and device for laser cladding with a primary and a secondary laser energy1 Oct 2026US 2026/0295731 A1TRUMPF Laser- und Systemtechnik GmbH
- Device and method for laser machining24 Sep 2026US 2026/0284786 A1Schott AG
- Electrode Manufacturing Equipment24 Sep 2026US 2026/0284792 A1SK On Co., Ltd.
Most cited
By later US patents
- Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer534US 7,335,611 B2APPLIED Materials.Inc. · 2008
- Process for treatment by irradiating an area of a body, and treatment apparatus usable in dermatology for the treatment of cutaneous angio dysplasias250US 5,336,217 AInstitut National de la Sante et de la Recherche Medicale (INSEPM) · 1994
- Skillful three-dimensional printing197US 10,071,422 B2Velo3D, Inc. · 2018
- Apparatuses for three-dimensional printing191US 9,962,767 B2Velo3D, Inc. · 2018
- Laser segmented cutting184US 6,676,878 B2Electro Scientific Industries, Inc. · 2004