Apparatus and method for cutting opening from workpiece
AssigneeABB Schweiz AG
InventorJinsong Li
Life of this patent
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Abstract
Devices and methods for cutting an opening from a workpiece. The apparatus comprises a first emitter and a second emitter, a power of a first laser emitted by the first emitter being smaller than a power of a second laser emitted by the second emitter. The apparatus further comprises a laser head, an image sensor, and a processing unit. The laser head is coupled to the first and second emitters and adapted to move adjacent to a first side of a workpiece and direct the first and second lasers onto the first side. The image sensor is configured to receive the first laser to form an image of the first laser. The processing unit is configured to determine a difference between a profile of the image of the first laser and a predetermined profile of an opening to be cut from the workpiece.
Claims10
An apparatus comprising:
- a first emitter and a second emitter, a power of a first laser emitted by the first emitter being smaller than a power of a second laser emitted by the second emitter;
- a laser head coupled to the first and second emitters and adapted to move adjacent to a first side of a workpiece and direct the first and second lasers onto the first side;
- and
- an image sensor arranged adjacent to a second side of the workpiece opposite to the first side and configured to receive the first laser to form an image of the first laser;
- wherein, in response to a difference between a profile of the image of the first laser received by the image sensor and a predetermined profile of an opening to be cut from the workpiece, the second emitter emits the second laser to cut the opening in the workpiece if the difference is below a predefined threshold.
A method, comprising:
- providing a first emitter and a second emitter, a power of a first laser emitted by the first emitter being smaller than a power of a second laser emitted by the second emitter;
- providing a laser head coupled to the first and second emitters and adapted to move adjacent to a first side of a workpiece and direct the first and second lasers onto the first side;
- arranging an image sensor adjacent to a second side of the workpiece opposite to the first side and configured to receive the first laser to form an image of the first laser;
- and
- in response to a difference between a profile of the image of the first laser received by the image sensor and a predetermined profile of an opening to be cut from the workpiece is below a predefined threshold, emitting the second laser by the second emitter to cut the opening in the workpiece.
Dependencies are inferred from the claim text.