B23K 2103/166
Multilayered materials
Official title: {Multilayered materials}
B23K2103/166 (Multilayered materials) appears on 1,034 US grants and 1,333 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,034
- Published applications
- 1,333
- Assignees
- 668
- Inventors
- 2,823
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 7 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 11 | 0 |
| 1998 | 13 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 7 |
| 2002 | 9 | 21 |
| 2003 | 21 | 22 |
| 2004 | 16 | 24 |
| 2005 | 17 | 33 |
| 2006 | 12 | 37 |
| 2007 | 13 | 42 |
| 2008 | 12 | 39 |
| 2009 | 20 | 45 |
| 2010 | 27 | 59 |
| 2011 | 42 | 62 |
| 2012 | 33 | 73 |
| 2013 | 52 | 53 |
| 2014 | 57 | 63 |
| 2015 | 47 | 65 |
| 2016 | 54 | 94 |
| 2017 | 49 | 108 |
| 2018 | 46 | 79 |
| 2019 | 72 | 87 |
| 2020 | 80 | 56 |
| 2021 | 50 | 55 |
| 2022 | 50 | 75 |
| 2023 | 39 | 53 |
| 2024 | 61 | 43 |
| 2025 | 31 | 21 |
| 2026 | 15 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of sealing glass assembly8 Sep 2026US 12,728,483 B2Corning Incorporated
- Multi-stage laser stripping of a rod-shaped conductor1 Sep 2026US 12,722,231 B2TRUMPF Laser- und Systemtechnik GmbH
- Method for manufacturing crash pad of vehicle16 Jun 2026US 12,654,647 B2Bsp Co., Ltd.
- Electroplated metal layer on a niobium-titanium substrate16 Jun 2026US 12,658,547 B2International Business Machines Corporation
- Ultrasonically bonding a flexible electronic circuit element having a plurality of vias9 Jun 2026US 12,651,880 B2St. Jude Medical, Cardiology Division, Inc.
- Secondary Battery and Method for Joining Electrode Lead1 Oct 2026US 2026/0302555 A1LG Energy Solution, Ltd.
- Al-fe-alloy plated steel sheet for hot forming, having excellent twb welding characteristics, hot forming member, and manufacturing methods therefor17 Sep 2026US 2026/0275473 A1Posco
- Laser apparatus and suction nozzle13 Aug 2026US 2026/0233333 A1Taikisha Ltd.
- Metal-resin composite molded product, method for processing metal member, and method for manufacturing metal-resin composite molded product25 Jun 2026US 2026/0175485 A1Polyplastics Co., Ltd.
- Sic semiconductor device and method for manufacturing the same25 Jun 2026US 2026/0181980 A1Rohm Co., Ltd.
Most cited
By later US patents
- Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer534US 7,335,611 B2APPLIED Materials.Inc. · 2008
- Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus388US 6,521,511 B1Seiko Epson Corporation · 2003
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus246US 6,878,607 B2Seiko Epson Corporation · 2005