B22F 2302/253
Aluminum oxide
Official title: Aluminum oxide (Al2O3)
B22F2302/253 (Aluminum oxide) appears on 64 US grants and 100 published applications in this corpus.
Search patents in B22F- Granted patents
- 64
- Published applications
- 100
- Assignees
- 78
- Inventors
- 275
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 2 |
| 2013 | 0 | 1 |
| 2014 | 2 | 3 |
| 2015 | 0 | 2 |
| 2016 | 2 | 9 |
| 2017 | 3 | 13 |
| 2018 | 5 | 4 |
| 2019 | 4 | 9 |
| 2020 | 5 | 6 |
| 2021 | 9 | 12 |
| 2022 | 6 | 7 |
| 2023 | 11 | 8 |
| 2024 | 10 | 8 |
| 2025 | 5 | 5 |
| 2026 | 1 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Material for thin, smooth, and high-velocity flame sprayed coatings with increased deposition efficiency16 Dec 2025US 12,497,683 B2Oerlikon Metco (US) Inc.
- Anti-fretting coating composition and coated components23 Sep 2025US 12,420,336 B2General Electric Company
- Oxidation and wear resistant brazed coating22 Apr 2025US 12,280,433 B2GE Infrastructure Technology LLC
- Soft magnetic powder composition for inductor core and method of manufacturing inductor core using the composition18 Feb 2025US 12,230,426 B2Electro M Co.,Ltd.
- Magnetic Beads1 Oct 2026US 2026/0302016 A1Seiko Epson Corporation
- Powder for thermal spraying17 Sep 2026US 2026/0273620 A1Fujimi Incorporated
- Nickel-Based Alloy Powder for Lamination Molding and Lamination Molded Body17 Sep 2026US 2026/0273621 A1Sanyo Special Steel Co., Ltd.
- Electrode, capacitive element, capacitor, precursor material, process of producing a precursor material, process of producing an electrode3 Sep 2026US 2026/0257272 A1
- Method of manufacturing ceramic matrix composites reinforced with metallic particles27 Aug 2026US 2026/0250202 A1Politechnika Warszawska
Most cited
By later US patents
- Direct writing for additive manufacturing systems21US 9,533,451 B23D Systems, Inc. · 2017
- Corrodible triggering elements for use with subterranean borehole tools having expandable members and related methods11US 8,844,635 B2Baker Hughes Incorporated · 2014
- Pump housing of two different sinterable materials10US 10,514,044 B2Heraeus Deutschland GmbH & Co. KG · 2019
- Powder for additive modeling, structure, semiconductor production device component, and semiconductor production device4US 10,759,712 B2Canon Kabushiki Kaisha · 2020
- Component with a ceramic base body having a conduit and a fastening element and method3US 10,679,778 B2Heraeus Deutschland GmbH & Co. KG · 2020