B22F 2007/047
Non-pressurised baking of the paste or slurry containing metal powder
Official title: {non-pressurised baking of the paste or slurry containing metal powder}
B22F2007/047 (Non-pressurised baking of the paste or slurry containing metal powder) appears on 78 US grants and 130 published applications in this corpus.
Search patents in B22F- Granted patents
- 78
- Published applications
- 130
- Assignees
- 82
- Inventors
- 267
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 6 |
| 2012 | 1 | 2 |
| 2013 | 2 | 6 |
| 2014 | 4 | 4 |
| 2015 | 1 | 4 |
| 2016 | 2 | 4 |
| 2017 | 4 | 11 |
| 2018 | 7 | 17 |
| 2019 | 7 | 8 |
| 2020 | 9 | 12 |
| 2021 | 6 | 10 |
| 2022 | 11 | 16 |
| 2023 | 2 | 5 |
| 2024 | 10 | 13 |
| 2025 | 5 | 7 |
| 2026 | 7 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for producing film25 Aug 2026US 12,715,038 B2LG Chem.Ltd.
- Sintering composition21 Jul 2026US 12,686,052 B2Alpha Assembly Solutions Inc.
- Copper fine particle dispersion7 Apr 2026US 12,594,598 B2Kao Corporation
- Paste composition and semiconductor device31 Mar 2026US 12,589,451 B2KYOCERA Corporation
- Copper paste for joining, method for manufacturing joined body, and joined body3 Mar 2026US 12,564,879 B2Resonac Corporation
- Producing Rotationally Symmetric Magnetic Sheets27 Aug 2026US 2026/0249352 A1Siemens Aktiengesellschaft
- Copper fine particle dispersion9 Jul 2026US 2026/0192358 A1Kao Corporation
- Method for Obtaining Base Metal and Alloy through High-Temperature Sintering and Anti-Oxidizing in Air15 Jan 2026US 2026/0014620 A1Changsha Zonekey Patent Law Firm
- Method for producing layered sheet structures from titanium or titanium alloys for use in electrodes of pem-type electrolyzers and/or fuel cells8 Jan 2026US 2026/0008102 A1Element 22 GmbH
- Oxide-containing plate-shaped copper particle, paste composition, semiconductor device, electrical component and electronic component3 Jul 2025US 2025/0214180 A1KYOCERA Corporation
Most cited
By later US patents
- Magnetic tape and magnetic tape device121US 10,074,393 B2FUJIFILM Corporation · 2018
- Dilution control in hardfacing severe service components33US 8,828,312 B2Kennametal Inc. · 2014
- Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices30US 8,497,420 B2E. I. Du Pont de Nemours and Company · 2013
- Conductive paste for external electrode and method for manufacturing electronic component including the conductive paste for external electrode23US 10,529,486 B2Murata Manufacturing Co., Ltd. · 2020
- Thick-film pastes containing lead-tellurium-boron-oxides, and their use in the manufacture of semiconductor devices18US 8,895,843 B2E. I. Du Pont de Nemours and Company · 2014