Copper fine particle dispersion
AssigneeKao Corporation
InventorsTakaaki Eyama, Osamu Takiguchi, Tomohide Yoshida
Life of this patent
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Abstract
A copper fine particle dispersion including copper nanoparticles A dispersed in the copper fine particle dispersion with a polymer B, and a dispersion medium C. The polymer B contains a constitutional unit derived from a carboxy group-containing monomer (b-1) and a polyalkylene glycol segment-containing monomer (b-2). A content of the polyalkylene glycol segment in the polymer B is not less than 55% by mass and not more than 97% by mass. An acid value of the polymer B is not less than 20 mgKOH/g and not more than 250 mgKOH/g. The dispersion medium C includes at least one compound selected from the group consisting of a (poly)alkylene glycol, a (poly)alkylene glycol derivative, a terpene alcohol, glycerin and a glycerin derivative.
Claims19
A copper fine particle dispersion comprising copper nanoparticles A dispersed in the copper fine particle dispersion with a polymer B, and a dispersion medium C, wherein:
- the polymer B comprises a constitutional unit derived from a carboxy group-containing monomer (b-1) and a constitutional unit derived from a polyalkylene glycol segment-containing monomer (b-2);
- a content of the polyalkylene glycol segment in the polymer B is not less than 55% by mass and not more than 97% by mass;
- an acid value of the polymer B is not less than 20 mgKOH/g and not more than 250 mgKOH/g;
- the dispersion medium C comprises at least one compound selected from the group consisting of a (poly)alkylene glycol, a (poly)alkylene glycol derivative, a terpene alcohol, glycerin and a glycerin derivative, and
- an average particle size of the copper nanoparticles A is not less than 105 nm and not more than 270 nm.
Dependencies are inferred from the claim text.