B05C 11/1007
Responsive to condition of liquid or other fluent material
Official title: {responsive to condition of liquid or other fluent material (B05C11/1005 takes precedence)}
B05C11/1007 (Responsive to condition of liquid or other fluent material) appears on 335 US grants and 400 published applications in this corpus.
Search patents in B05C- Granted patents
- 335
- Published applications
- 400
- Assignees
- 208
- Inventors
- 925
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 2 | 2 |
| 2002 | 10 | 6 |
| 2003 | 9 | 13 |
| 2004 | 7 | 8 |
| 2005 | 5 | 8 |
| 2006 | 5 | 6 |
| 2007 | 2 | 3 |
| 2008 | 3 | 5 |
| 2009 | 1 | 5 |
| 2010 | 1 | 9 |
| 2011 | 2 | 4 |
| 2012 | 6 | 12 |
| 2013 | 8 | 13 |
| 2014 | 4 | 17 |
| 2015 | 13 | 22 |
| 2016 | 14 | 18 |
| 2017 | 18 | 17 |
| 2018 | 15 | 37 |
| 2019 | 16 | 35 |
| 2020 | 29 | 20 |
| 2021 | 25 | 20 |
| 2022 | 14 | 24 |
| 2023 | 10 | 31 |
| 2024 | 23 | 28 |
| 2025 | 23 | 19 |
| 2026 | 17 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for monitoring liquid adhesive flow29 Sep 2026US 12,747,968 B2Nordson Corporation
- Film forming apparatus and method for manufacturing part having film containing silicon15 Sep 2026US 12,734,543 B2Tokyo Electron Limited
- Nozzle, coating device, and coating method11 Aug 2026US 12,703,001 B2Terumo Kabushiki Kaisha
- Material reconditioning and dispensing system16 Jun 2026US 12,654,193 B2GM Global Technology Operations LLC
- Method for multiple filtration of dispensing liquid in a liquid dispense system2 Jun 2026US 12,645,143 B2Tokyo Electron Limited
- Electrode Slurry Coating System and Electrode Slurry Coating Method6 Aug 2026US 2026/0225126 A1LG Energy Solution, Ltd.
- System and method for extracting active material residue from an assembly for coating an electrode with an active material layer and corresponding assembly, method for manufacturing an electrode, electrode and battery6 Aug 2026US 2026/0225127 A1LG Energy Solution, Ltd.
- Electrode Sheet Manufacturing Apparatus and Electrode Sheet Manufacturing Method Using the Same6 Aug 2026US 2026/0229479 A1LG Energy Solution, Ltd.
- Liquid adhesion apparatus and liquid adhesion method23 Jul 2026US 2026/0208223 A1Lintec Corporation
- Slot die coater and slot die coating method using the same11 Jun 2026US 2026/0158519 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Flip chip underfill system and method102US 5,906,682 ANordson Corporation · 1999
- Viscous material dispensing machine having programmed positioning84US 4,584,964 A1986
- Automatic metering and dispensing system70US 4,046,287 AGraco Inc. · 1977
- Monitor for fluid dispensing system69US 5,481,260 ANordson Corporation · 1996
- Apparatus and method for processing hot melt adhesives56US 7,626,143 B22009