A21C 15/02

Apparatus for shaping or moulding baked wafers

Official title: Apparatus for shaping or moulding baked wafers; Making multi-layer wafer sheets

A21C15/02 (Apparatus for shaping or moulding baked wafers) appears on 137 US grants and 111 published applications in this corpus.

Search patents in A21C
Granted patents
137
Published applications
111
Assignees
86
Inventors
252
Latest grant
16 Jun 2026

Filings by year

A21C 15/02: granted patents and published applications per publication year
YearGranted patentsPublished applications
197640
197720
197850
197920
198010
198130
198230
198320
198450
198540
198680
198730
198820
198940
199030
199120
199210
199310
199450
199510
199650
199740
199820
199930
200000
200145
200212
200349
200426
200513
200615
200704
2008215
200914
201035
201125
201240
201332
201424
201537
201632
201722
201837
201934
202035
202123
202214
202350
202424
202531
202623

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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Granted patents