Thermal Form & Function LLC
Manchester, MA, US· latest recorded location
Thermal Form & Function LLC is named on 5 US grants and 1 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 5
- Published applications
- 1
- Inventors
- 4
- Granted in 2026 so far
- 0
- Most recent grant
- 20 Jan 2004
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 3 | 1 |
| 2004 | 1 | 0 |
By publication year.
Technology areas
Share of 6 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by6
- F25BRefrigeration machines, plants or systems4
- F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange3
- F28FDetails of heat-exchange and heat-transfer apparatus, of general application1
Recent patents
- Pumped liquid cooling system using a phase change refrigerant20 Jan 2004US 6,679,081 B2
- Corrugated matrix heat sink for cooling electronic components9 Sep 2003US 6,615,909 B2
- Pumped liquid cooling system using a phase change refrigerant18 Feb 2003US 6,519,955 B2
- Cold plate utilizing fin with evaporating refrigerant21 Jan 2003US 6,508,301 B2
- Convoluted fin heat sinks with base topography for thermal enhancement17 Jul 2001US 6,260,610 B1
Most cited
By later US patents
- Pumped liquid cooling system using a phase change refrigerant88US 6,519,955 B22003
- Pumped liquid cooling system using a phase change refrigerant77US 6,679,081 B22004
- Cold plate utilizing fin with evaporating refrigerant50US 6,508,301 B22003
- Convoluted fin heat sinks with base topography for thermal enhancement19US 6,260,610 B12001
- Corrugated matrix heat sink for cooling electronic components13US 6,615,909 B22003