Pumped liquid cooling system using a phase change refrigerant
AssigneeThermal Form & Function LLC
InventorJoseph Marsala
Life of this patent
Estimating the term…
Abstract
An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.
Claims10
An improved cooling system comprising:
- at least one component generating heat and required to be cooled;
- at least one cold plate evaporator device in thermal contact with the at least one component;
- a liquid refrigerant pump;
- a vaporizable refrigerant circulated by the liquid refrigerant pump to the at least one cold plate evaporator device;
- a liquid manifold for receiving the vaporizable refrigerant from the liquid refrigerant pump;
- means for returning the unevaporated vaporizable refrigerant to the liquid refrigerant pump, whereby the refrigerant is at least partially evaporated by the heat generated by the at least one component, creating a vapor;
- a condenser for condensing the vapor, creating a condensed liquid;
- at least one return line to return liquid refrigerant to the pump;
- and
- a liquid return line from the condenser.
Dependencies are inferred from the claim text.