Pumped liquid cooling system using a phase change refrigerant
AssigneeThermal Form & Function LLC
InventorJoseph Marsala
Life of this patent
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Abstract
An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.
Claims7
A method for cooling one or more electrical or electronic components generating heat and required to be cooled, the method comprising the steps of:
- locating at least one cold plate evaporator device in thermal contact with the one or more electrical or electronic components;
- providing a liquid refrigerant pump;
- providing a refrigerant;
- providing a liquid receiver for, receiving the liquid refrigerant;
- returning the liquid refrigerant to the liquid refrigerant pump;
- using the liquid refrigerant pump to circulate refrigerant to the at least one cold plate evaporator device, whereby the refrigerant is at least partially evaporated by the heat generated by the one or more electrical or electronic components, creating a vapor;
- using a condenser to condense the vapor to create a condensed liquid;
- providing an unevaporated liquid return line;
- and
- providing a liquid return line from the condenser.
Dependencies are inferred from the claim text.