STAT ChipPAC, Ltd.
Singapore, SG· latest recorded location
STAT ChipPAC, Ltd. is named on 3 US grants and 1 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 3
- Published applications
- 1
- Inventors
- 10
- Granted in 2026 so far
- 0
- Most recent grant
- 19 Aug 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 1 | 0 |
| 2014 | 1 | 0 |
By publication year.
Technology areas
Share of 4 documents
Recent patents
- Integrated circuit packaging system with high lead count and method of manufacture thereof19 Aug 2014US 8,810,015 B2
- Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation7 May 2013US 8,435,881 B2
- Semiconductor device and method of forming WLCSP structure using protruded MLP25 Sep 2012US 8,273,604 B2
Most cited
By later US patents
- Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation28US 8,435,881 B22013
- Semiconductor device and method of forming WLCSP structure using protruded MLP7US 8,273,604 B22012
- Integrated circuit packaging system with high lead count and method of manufacture thereof3US 8,810,015 B22014