Integrated circuit packaging system with high lead count and method of manufacture thereof
AssigneeSTAT ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Frederick Rodriguez Dahilig
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a leadframe with a tiebar and an outer lead having an outer lead outer pad; forming an inner lead on a peel strip; attaching the leadframe to the peel strip around the inner lead; wire bonding a die to the outer lead and the inner lead; encapsulating the die and portions of the outer lead and the inner lead; removing the peel strip to expose a bottom surface of the inner lead; and removing the leadframe to have the outer lead outer pad of the outer lead coplanar with the bottom surface of the inner lead.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming a leadframe with a tiebar and an outer lead having an outer lead outer pad;
- forming an inner lead on a peel strip;
- attaching the leadframe to the peel strip around the inner lead;
- wire bonding a die to the outer lead and the inner lead;
- encapsulating the die and portions of the outer lead and the inner lead;
- removing the peel strip to expose a bottom surface of the inner lead;
- and
- removing the leadframe to have the outer lead outer pad of the outer lead coplanar with the bottom surface of the inner lead.
A method of manufacture of an integrated circuit packaging system comprising:
- forming a leadframe with a tiebar and an outer lead having an outer lead outer pad;
- forming an inner lead on a peel strip;
- attaching the leadframe to the peel strip around the inner lead by a tiebar contact pad at the end of the tiebar;
- wire bonding a die to the outer lead and the inner lead;
- encapsulating the die and portions of the outer lead and the inner lead;
- removing the peel strip to expose a bottom surface of the inner lead;
- and
- removing the leadframe to have the outer lead outer pad of the outer lead coplanar with the bottom surface of the inner lead.
An integrated circuit packaging system comprising:
- a tiebar and an outer lead;
- an inner lead with a bottom surface exposed;
- a die wire bonded to the outer lead and the inner lead;
- a mold compound encapsulating the die and portions of the outer lead and the inner lead;
- and
- an outer lead outer pad at an end of the outer lead, the outer lead outer pad being coplanar with the bottom surface of the inner lead.
Dependencies are inferred from the claim text.