Integrated circuit packaging system with high lead count and method of manufacture thereof
AssigneeSTAT ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Frederick Rodriguez Dahilig
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a leadframe with a tiebar and an outer lead having an outer lead outer pad; forming an inner lead on a peel strip; attaching the leadframe to the peel strip around the inner lead; wire bonding a die to the outer lead and the inner lead; encapsulating the die and portions of the outer lead and the inner lead; removing the peel strip to expose a bottom surface of the inner lead; and removing the leadframe to have the outer lead outer pad of the outer lead coplanar with the bottom surface of the inner lead.
Claims18
A method of manufacture of an integrated circuit packaging system comprising:
- forming a leadframe with a tiebar having a tiebar contact pad and an outer lead having an outer lead outer pad;
- forming inner leads arranged in staggered rows on a peel strip;
- attaching the leadframe to the peel strip around the inner leads;
- wire bonding a die to the outer lead and the inner leads;
- forming an adhesion element directly on the tiebar contact pad and between the tiebar contact pad and the peel strip;
- encapsulating the die and portions of the outer lead and the inner leads with a mold case having a mold case sidewall to form a mold compound, the mold case side wall being aligned with a tapered peel strip side wall without any angles therebetween;
- removing the peel strip to expose a bottom surface of the inner lead and a portion of the adhesion element wherein the portion of the adhesion element is coplanar with the mold compound;
- and
- removing the leadframe to have a bottom plane of the outer lead outer pad having the same plane as the bottom surface of the inner leads.
A method of manufacture of an integrated circuit packaging system comprising:
- forming a leadframe with a tiebar having a tiebar contact pad and an outer lead having an outer lead outer pad;
- forming inner leads arranged in staggered rows on a peel strip;
- attaching the leadframe to the peel strip around the inner leads by the tiebar contact pad at the end of the tiebar;
- forming an adhesion element directly on the tiebar contact pad and between the tiebar contact pad and the peel strip;
- wire bonding a die to the outer lead and the inner leads;
- encapsulating the die and portions of the outer lead and the inner leads with a mold case having a mold case sidewall to form a mold compound, the mold case side wall being aligned with a tapered peel strip side wall without any angles therebetween;
- removing the peel strip to expose a bottom surface of the inner lead and a portion of the adhesion element wherein the portion of the adhesion element is coplanar with the mold compound;
- and
- removing the leadframe to have a bottom plane of the outer lead outer pad having the same plane as the bottom surface of the inner leads.
An integrated circuit packaging system comprising:
- a tiebar having a tiebar contact pad;
- an outer lead adjacent the tiebar;
- inner leads arranged in staggered rows with a bottom surface exposed;
- a die wire bonded to the outer lead and the inner leads;
- a mold compound encapsulating the die and portions of the outer lead and the inner leads, the mold compound having a tapered profile from the outer lead directly to the inner leads;
- an adhesion element directly on the tiebar contact pad, a portion of the adhesion element exposed from and coplanar with a bottom side of the mold compound, and the adhesion element between the tiebar contact pad and the bottom side of the mold compound;
- and
- wherein:
- the outer lead has an outer lead outer pad at an end of the outer lead, and a bottom plane of the outer lead outer pad having the same plane as the bottom surface of the inner leads.
Dependencies are inferred from the claim text.