Scanner Technologies Corporation
Minneapolis, MN, US· latest recorded location
Scanner Technologies Corporation is named on 4 US grants and 4 published applications in this corpus. Its most frequent classification is G06T (Image data processing or generation, in general).
- Granted patents
- 4
- Published applications
- 4
- Inventors
- 2
- Granted in 2026 so far
- 0
- Most recent grant
- 26 Jan 2010
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 3 |
| 2006 | 2 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 1 | 0 |
By publication year.
Technology areas
Share of 8 documents
- G06TImage data processing or generation, in general8
- H05KPrinted circuits8
- G01NInvestigating or analysing materials by determining their chemical or physical properties2
- G06VImage and video recognition2
- H04NPictorial communication2
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by2
Recent patents
- Method of manufacturing ball array devices using an inspection apparatus having two or more cameras and ball array devices produced according to the method26 Jan 2010US 7,653,237 B2
- Electronic component products and method of manufacturing electronic component products24 Mar 2009US 7,508,974 B2
- Method of manufacturing electronic components including a method for three dimensional inspection1 Aug 2006US 7,085,411 B2
- Electronic component products made according to a process that includes a method for three dimensional inspection18 Jul 2006US 7,079,678 B2
- Method of Manufacturing Ball Array Devices Using an Inspection Apparatus having Two or More Cameras and Ball Array Devices Produced According to the Method9 Aug 2007US 2007/0183646 A1
- Electronic component products and method of manufacturing electronic component products1 Sep 2005US 2005/0189657 A1
- Electronic component products made according to a process that includes a method for three dimensional inspection1 Sep 2005US 2005/0190960 A1
- Method of manufacturing electronic components including a method for three dimensional inspection1 Sep 2005US 2005/0190961 A1
Most cited
By later US patents
- Method of manufacturing electronic components including a method for three dimensional inspection6US 7,085,411 B22006
- Electronic component products made according to a process that includes a method for three dimensional inspection5US 7,079,678 B22006
- Electronic component products and method of manufacturing electronic component products3US 7,508,974 B22009
- Method of manufacturing ball array devices using an inspection apparatus having two or more cameras and ball array devices produced according to the method1US 7,653,237 B22010