Electronic component products and method of manufacturing electronic component products

A method of manufacturing a ball array device, the method comprising:

• making a three dimensional inspection of a lead on the ball array device with the ball array device being positioned in an optical system;
• and
• selecting the ball array device as a produced ball array device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the ball array device to produce reflections;
• taking a first image of the reflections with a first camera disposed in a first fixed position to obtain a circular doughnut shape image of the ball array device;
• taking a second image of the reflections with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array device;
• and
• processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane.

A method of manufacturing a ball array device, the method comprising:

• making a three dimensional inspection of a lead on the ball array device with the ball array device being positioned in an optical system;
• and
• selecting the ball array device as a produced ball array device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the ball array device;
• taking a first image of the ball array device with a first camera disposed in a first fixed position relative to the ball array device to obtain a circular doughnut shape view of the ball array device, wherein the first camera includes a charged coupled device array;
• taking a second image of the ball array device with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array device, wherein a fixed mirror is interposed to reflect light between the ball array device and the second camera, and wherein the second camera includes a charged coupled device array;
• and
• processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane, wherein the calibration plane comprises a coordinate system having X, Y and Z axes, and wherein an X measurement value is proportional to a Z measurement value.