Method of manufacturing electronic components including a method for three dimensional inspection

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead;
• providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead;
• receiving at least the bottom view and the side perspective view of the lead using a single camera;
• transmitting the bottom view and the side perspective view of the lead to memory as pixel values;
• determining a first lead reference pixel position in the bottom view;
• determining a second lead reference pixel position in the side view;
• and
• converting the first lead reference pixel position into a first world value and the second lead reference pixel position into a second world value by using pixel values and parameters determined during a calibration.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on a BGA device, wherein the BGA device comprises a plurality of balls, with the BGA device being positioned in an optical system;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating at least one ball on the BGA device using a fixed illumination system;
• disposing a single sensor, a first optical element and a second optical element in relation to the BGA device so that the sensor obtains at least two differing views of the at least one ball, the sensor providing output representing the at least two differing views;
• and
• processing the output using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a BGA device, wherein the BGA device comprises a plurality of balls, with the BGA device being positioned in an optical system;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the BGA device using a fixed illumination system;
• disposing a single sensor to receive light at a first angle relative to the BGA device;
• positioning a first optical element to transmit light to the sensor, where the sensor obtains a first view of the BGA device;
• disposing a second optical element to receive light at a second angle different from the first angle and to provide a second view of the BGA device to the sensor;
• transmitting image information from the sensor;
• and
• processing the image information by applying triangulation calculations to measurements of the image information so as to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a BGA device, wherein the BGA device comprises a plurality of balls, with the BGA device being positioned in an optical system;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the BGA device using a fixed illumination system;
• taking a first image of the BGA device with a single camera disposed in a fixed focus position relative to the BGA device to obtain a circular doughnut shape image from at least one ball;
• taking a second image of the BGA device with an optical element disposed in a fixed focus position relative to the BGA device to transmit a side view image of the at least one ball to the camera;
• and
• processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

A method of manufacturing a ball grid array (BGA) device;

• the method comprising:
• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing at least one sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using parameters determined during a calibration.

A method of manufacturing a BGA (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead with a ring light and a side light;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing at least one sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using parameters determined during a calibration.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead with a ring light and a side light;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing at least one sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead;
• providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape;
• disposing at least one sensor to obtain the first and second views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead;
• providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape;
• disposing at least one sensor to obtain the first and second views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead with a ring light and a side light;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing a single sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using parameters determined during a calibration.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead with a ring light and a side light that are spectrally diverse from one another;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing a single sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using parameters determined during a calibration.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead with a ring light and a side light;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing a single one sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead with a ring light and a side light;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing a single one sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead with a ring light and a side light that are spectrally diverse from one another;
• providing fixed optical elements to obtain two differing views of the lead;
• disposing a single one sensor to obtain the two differing views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.

A method of manufacturing a ball grid array (BGA) device, the method comprising:

• making a three dimensional inspection of a lead on the BGA device;
• and
• selecting the BGA device as a produced BGA device based upon the results of the three dimensional inspection;
• wherein the three dimensional inspection comprises:
• illuminating the lead;
• providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape;
• disposing a single sensor to obtain the first and second views of the lead;
• transmitting the two differing views of the lead to memory;
• determining a first lead reference position in a first view;
• determining a second lead reference position in a second view;
• and
• converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.

A method of manufacturing a ball grid array (BGA) device having a plurality of leads, the method comprising:

• calibrating a system with a planar precision pattern;
• illuminating the leads;
• providing fixed optical elements;
• obtaining a single bottom view of the leads;
• obtaining a single side view of the leads;
• determining a first lead reference position in a bottom view;
• determining a second lead reference position in a side view;
• converting the first and second lead reference positions into a Z value;
• comparing a Z value to a tolerance value;
• determining a pass result;
• and
• selecting the BGA device as a manufactured product.