Polycon Corporation
Tempe, AZ, US· latest recorded location
Polycon Corporation is named on 4 US grants and 0 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 4
- Published applications
- 0
- Inventors
- 1
- Granted in 2026 so far
- 0
- Most recent grant
- 1 Feb 1994
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
By publication year.
Technology areas
Share of 4 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by3
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3
- H05KPrinted circuits2
- G01RMeasuring electric variables1
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered1
Recent patents
- Hybrid circuit structures and methods of fabrication1 Feb 1994US 5,282,922 A
- Laser lithography for integrated circuit and integrated circuit interconnect manufacture23 Mar 1993US 5,196,376 A
- Method of making electrical probe diaphragms9 Jul 1991US 5,030,318 A
- Method of fabricating hybrid circuit structures11 Jun 1991US 5,023,205 A
No published applications.
Most cited
By later US patents
- Method of fabricating hybrid circuit structures35US 5,023,205 A1991
- Laser lithography for integrated circuit and integrated circuit interconnect manufacture28US 5,196,376 A1993
- Method of making electrical probe diaphragms27US 5,030,318 A1991
- Hybrid circuit structures and methods of fabrication3US 5,282,922 A1994