Method of fabricating hybrid circuit structures
AssigneePolycon Corporation
InventorJohn J. Reche
Life of this patent
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Abstract
Hybrid circuit structures and methods of fabrication which result in improved manufacturing yields and reliability in use are disclosed. The methods disclosed include methods of forming on the hybrid circuit substrate, a ground plane, bonding pads, and interconnects, which minimize the likelihood of forming catastrophic defects in various insulation layers during the manufacturing processing, which minimize the likelihood of damage to the bonding pads when bonding integrated circuit leads thereto, and which minimize the thermal stressing of a finished product due to the differential expansion between the various layers making up the same. Alternate methods and structures are disclosed.
Claims10
In a method of forming a ground plane on a substrate in a high density multilayer interconnect fabrication process, comprising the steps of;
- (a) depositing a layer of metal on the substrate;
- (b) putting a layer of polymer over the layer of metal deposited in step (a);
- (c) depositing a layer of metal over the layer of polymer in step (b);
- (d) patterning the layer of metal of step (c), and the layer of polymer of step (b) where the same is not masked by the remaining parts of the metal layer of step (c);
- (e) putting a layer of polymer over the layer of metal deposited in step (a);
- (f) depositing a layer of metal over the layer of polymer of step (e);
- (g) patterning the layer of metal of step (f);
- (h) putting a layer of polymer over the patterned layer of metal;
- (i) patterning the layer of polymer of step (h), and the layer of polymer of step (e) where the same is not masked by the metal layer of steps (f) and (g);
- and whereby the first patterning of the polymer layer of step (e) occurs after the polymer layer of step (h) is applied;
- and wherein steps (b) through (d) in part form the bonding pads for the high density multilayer interconnect.
Dependencies are inferred from the claim text.