Onscreen Technologies, Inc.
Portland, OR, US· latest recorded location
ONSCREEN TECHNOLOGIES, INC. is named on 8 US grants and 16 published applications in this corpus. Its most frequent classification is G09F (Displaying).
- Granted patents
- 8
- Published applications
- 16
- Inventors
- 19
- Granted in 2026 so far
- 0
- Most recent grant
- 7 Jun 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 3 | 2 |
| 2007 | 1 | 6 |
| 2008 | 1 | 5 |
| 2009 | 1 | 0 |
| 2010 | 1 | 0 |
| 2011 | 1 | 0 |
By publication year.
Technology areas
Share of 24 documents
- G09FDisplaying13
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by12
- H05KPrinted circuits10
- D03DWoven fabrics7
- D10BIndexing scheme associated with sublasses of section d, relating to textiles7
- F28FDetails of heat-exchange and heat-transfer apparatus, of general application5
- H10HInorganic light-emitting semiconductor devices having potential barriers4
- H04BTransmission3
- F21KNon-electric light sources using luminescence2
- F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange2
Recent patents
- Solar heat transfer apparatus7 Jun 2011US 7,956,278 B1
- Cooling systems incorporating heat transfer meshes13 Apr 2010US 7,694,722 B2
- Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density25 Aug 2009US 7,579,218 B2
- LED assembly with vented circuit board1 Jan 2008US 7,315,049 B2
- Cooling systems incorporating heat transfer meshes22 May 2007US 7,219,715 B2
- Cooling device for an electronic component22 May 2008US 2008/0115916 A1
- Circuit board assemblies with combined fluid-containing heatspreader-ground plane and methods therefor17 Apr 2008US 2008/0087456 A1
- Sealed self-contained fluidic cooling device27 Mar 2008US 2008/0073062 A1
- Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density7 Feb 2008US 2008/0032461 A1
- Collapsible support stand10 Jan 2008US 2008/0006746 A1
Most cited
By later US patents
- LED assembly with vented circuit board28US 7,138,659 B22006
- Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density24US 7,144,748 B22006
- Cooling systems incorporating heat transfer meshes16US 7,219,715 B22007
- Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density15US 7,105,858 B22006
- LED assembly with vented circuit board13US 7,315,049 B22008