Cooling systems incorporating heat transfer meshes
AssigneeOnscreen Technologies, Inc.
InventorJohn M. Popovich
Life of this patent
Estimating the term…
Abstract
Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.
Claims37
Apparatus for cooling of an electrical element package, comprising in combination
- a) structure including a hollow body, defining a cavity containing cooling fluid,
- b) the structure defining an opening or passage whereby direct contact of the cooling fluid with said package is established for heat transfer from the package to the fluid contained in the cavity,
- c) a mesh located to enhance said heat transfer,
- d) and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid,
- e) and including a fluid seal between surfaces defined by the body and the package, adjacent said opening.
Heat transfer apparatus comprising, in combination:
- a) a source of heat from electrical equipment, and having a heat transfer surface,
- b) a wire mesh extending proximate said surface to receive heat transfer therefrom, the mesh including certain wires, and other wires, said certain and other wires forming interstices,
- c) and means for passing a coolant fluid generally parallel to the mesh, for flow through said interstices, to receive heat transfer from the mesh,
- d) and including a second heat transfer mesh receiving said coolant fluid that flows from the first mentioned mesh, and other means for transferring heat from the second mesh,
- e) and wherein said other means includes coolant fluid passing through said second mesh, generally parallel to a plane defined by the second mesh.
Heat transfer apparatus comprising, in combination:
- a) a source of heat from electrical equipment, and having a heat transfer surface,
- b) a wire mesh extending proximate said surface to receive heat transfer therefrom, the mesh including certain wires, and other wires, said certain and other wires forming interstices,
- c) and means for passing a coolant fluid generally parallel to the mesh, for flow through said interstices, to receive heat transfer from the mesh,
- d) and wherein said mesh is a first mesh, and including a second mesh receiving coolant fluid from the first mesh, for receiving heat therefrom and for transferring heat to heat dissipating means,
- e) and wherein said first mesh is substantially planar, and said coolant fluid flows within the first mesh in the direction or directions of planar extent thereof, and said second mesh is substantially planar and said coolant fluid flows within the second mesh in the direction or directions of planar extent thereof.
An apparatus for cooling an integrated circuit having a package, said apparatus being attachable to the integrated circuit and having a hollow body, wherein a cavity formed by said hollow body contains fluid for cooling of the integrated circuit through an opening of the cavity, and at the surface making contact between the cooling apparatus and the integrated circuit, so that the fluid is in direct contact with the integrated circuit's package.
Heat transfer apparatus comprising, in combination:
- a) a source of heat from electrical equipment, and having a heat transfer surface,
- b) a wire mesh extending proximate said surface to receive heat transfer therefrom, the mesh including certain wires, and other wires, said certain and other wires forming interstices,
- c) and means for passing a coolant fluid generally parallel to the mesh, for flow through said interstices, to receive heat transfer from the mesh,
- d) and wherein said mesh is a first mesh, and including a second mesh receiving coolant fluid from the first mesh, for receiving heat therefrom and for transferring heat to heat dissipating means,
- e) and wherein the heat dissipating means includes another fluid operable to change phase upon receiving heat transfer from the coolant fluid.
Heat transfer apparatus comprising, in combination:
- a) a source of heat from electrical equipment, and having a heat transfer surface,
- b) a wire mesh extending proximate said surface to receive heat transfer therefrom, the mesh including certain wires, and other wires, said certain and other wires forming interstices,
- c) and means for passing a coolant fluid generally parallel to the mesh, for flow through said interstices, to receive heat transfer from the mesh,
- d) and including a second heat transfer mesh receiving said coolant fluid that flows from the first mentioned mesh, and other means for transferring heat from the second mesh,
- e) and including a polymer selectively filled into at least a portion or portions of at least one of said meshes for coolant fluid flow organization.
Heat transfer apparatus comprising, in combination:
- a) a source of heat from electrical equipment, and having a heat transfer surface,
- b) a wire mesh extending proximate said surface to receive heat transfer therefrom, the mesh including certain wires, and other wires, said certain and other wires forming interstices,
- c) and means for passing a coolant fluid generally parallel to the mesh, for flow through said interstices, to receive heat transfer from the mesh,
- d) and wherein said mesh is a first mesh, and including a second mesh receiving coolant fluid from the first mesh, for receiving heat therefrom and for transferring heat to heat dissipating means,
- e) and wherein said first mesh is substantially planar, and said coolant fluid flows within the first mesh in the direction or directions of planar extent thereof, and said second mesh is substantially planar and said coolant fluid flows within the second mesh in the direction or directions of planar extent thereof,
- f) and including a fluid coolant pump located between said first and second meshes,
- g) and wherein said pump has a glass disc rotor.
Apparatus for cooling of an electrical element package, comprising in combination
- a) structure including a hollow body, defining a cavity containing cooling fluid,
- b) the structure defining an opening or passage whereby direct contact of the cooling fluid with said package is established for heat transfer from the package to the fluid contained in the cavity,
- c) a mesh located to enhance said heat transfer,
- d) and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid,
- e) and wherein the package is at least in part embedded or sunk in the mesh.
Dependencies are inferred from the claim text.