Sealed self-contained fluidic cooling device
AssigneeOnscreen Technologies, Inc.
InventorFranz Schuette
Life of this patent
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Abstract
A cooling system and method for cooling electronic components, including IC dies. The cooling system employs a cooling device that includes a composite structure having first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween. The first plate has a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component. A mesh of interwoven strands is disposed within the cavity and lies in a plane substantially parallel to the first and second plates, with the strands bonded to the first and second plates. A fluid is contained and sealed within the cavity of the composite structure, and flows through interstices defined by and between the strands of the mesh.
Claims20
A cooling device for transferring thermal energy from an electronic component to the environment, the cooling device comprising:
- a composite structure comprising first and second plates arranged substantially in parallel and bonded together to define a sealed cavity therebetween, the first plate having a surface that defines an outer surface of the composite structure and is adapted for thermal contact with at least one electronic component;
- a mesh disposed within the cavity and lying in a plane substantially parallel to the first and second plates, the mesh comprising interwoven strands bonded to the first and second plates;
- a fluid contained and sealed within the cavity of the composite structure;
- interstices defined by and between the strands of the mesh through which the fluid within the cavity is able to flow.
A method of transferring thermal energy from an electronic component to the environment, comprising:
- absorbing heat dissipated by an electronic component with a first plate arranged substantially in parallel and bonded to a second plate so as to define a composite structure and a sealed cavity between the first and second plates, the first plate having a surface that defines an outer surface of the composite structure and is adapted for thermal contact with the electronic component;
- transferring the absorbed heat through the cavity and into the second plate via a fluid and a mesh contained in the cavity, the mesh lying in a plane substantially parallel to the first and second plates, the mesh comprising interwoven strands bonded to the first and second plates and defining interstices through which the fluid is able to flow, the fluid acting as a secondary heat absorbent and a thermal transport media that transports thermal energy to the mesh at a distance from the first plate;
- and
- dissipating the absorbed heat to the environment with the second plate.
Dependencies are inferred from the claim text.