Manufacturing Integration Technology Ltd
Singapore, SG· latest recorded location
Manufacturing Integration Technology Ltd is named on 6 US grants and 6 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 6
- Published applications
- 6
- Inventors
- 13
- Granted in 2026 so far
- 0
- Most recent grant
- 3 Sep 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 2 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 1 | 0 |
| 2019 | 1 | 0 |
By publication year.
Technology areas
Share of 12 documents
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered6
- Y10TTechnical subjects covered by former us classification4
- B23KSoldering or unsoldering3
- B41JTypewriters3
- G02BOptical elements, systems or apparatus3
- H10FSolar cells and light sensors3
- Y02EClean energy generation and storage3
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by2
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2
Recent patents
- Laser scribing of thin-film solar cell panel3 Sep 2019US 10,403,782 B2
- System and method for peeling a semiconductor chip from a tape using a multistage ejector27 Mar 2018US 9,929,036 B2
- Adaptive clamp width adjusting device21 Oct 2014US 8,864,121 B2
- Apparatus for object processing20 May 2014US 8,727,693 B2
- Method and apparatus for precise marking and placement of an object22 Apr 2008US 7,363,102 B2
- Laser Scribing Of Thin-Film Solar Cell Panel10 Aug 2017US 2017/0229604 A1
- System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector11 May 2017US 2017/0133259 A1
- Laser Scribing Of Thin-Film Solar Cell Panel19 Jul 2012US 2012/0181259 A1
- Adaptive Clamp Width Adjusting Device28 Apr 2011US 2011/0095467 A1
- Apparatus for object processing7 Apr 2011US 2011/0081223 A1
Most cited
By later US patents
- Method and apparatus for precise marking and placement of an object4US 7,155,299 B22006
- System and method for peeling a semiconductor chip from a tape using a multistage ejector3US 9,929,036 B22018
- Method and apparatus for precise marking and placement of an object2US 7,363,102 B22008
- Adaptive clamp width adjusting device1US 8,864,121 B22014