System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector

A method for peeling a semiconductor chip from a tape, the method comprising:

• placing plural sets of tape removing contacts under the tape on which the chip is attached, wherein the plural sets of tape removing contacts are in a non-activated position;
• coupling a pickup and place unit to the free surface of the chip;
• creating a vacuum for holding the tape firmly to the top surface of a housing;
• moving the plural sets of tape removing contacts upwards by a first predefined distance;
• simultaneously, moving the pickup and place unit upwards by the first predefined distance;
• selectively moving at least one set of the plural sets of tape removing contacts downwards to effectively loosen the tape from the chip in steps till all the sets of the plural sets of tape removing contacts are moved downwards;
• and
• removing the chip using the pickup and place unit after all the sets of the plural sets of tape removing contacts are moved downwards.

A method for peeling a semiconductor chip from a tape, the method comprising:

• placing plural sets of tape removing contacts under the tape on which the chip is attached, wherein the plural sets of tape removing contacts are in a non-activated position;
• coupling a pickup and place unit to the free surface of the chip;
• creating a vacuum for holding the tape firmly to the top surface of a housing;
• moving the plural sets of tape removing contacts upwards by a first predefined distance;
• moving, simultaneously, the pickup and place unit upwards by the first predefined step;
• moving at least one set of the plural sets of tape removing contacts further upwards in steps of second and third predefined distance;
• and
• removing the chip using the pickup and place unit when only the last set of the plural sets of tape removing contacts is attached to the tape.

A method for peeling a semiconductor chip from a tape, the method comprising:

• placing plural sets of tape removing contacts under the tape on which the chip is attached, wherein the plural sets of tape removing contacts are in a non-activated position;
• coupling a pickup and place unit to the free surface of the chip;
• creating a vacuum for holding the tape firmly to the top surface of a housing;
• moving alternate sets of the plural sets of tape removing contacts upwards by a first predefined distance;
• simultaneously, moving the pickup and place unit upwards by the first predefined distance;
• selectively moving at least one set of alternate sets of the plural sets of tape removing contacts downwards by the first predefined distance and other set of alternate sets of the plural sets of tape removing contacts upwards by a second predefined distance;
• moving the middle set of tape removing contacts and the other set of the alternate sets of the plural sets of tape removing contacts upwards by a third predefined distance to effectively loosen the tape from the chip in steps till all the upward moved plural sets of tape removing contacts are moved downwards;
• and
• removing the chip using the pickup and place unit after all the sets of the plural sets of tape removing contacts are moved downwards.