Magic Corporation
Hsin-Chu, TW· latest recorded location
Magic Corporation is named on 4 US grants and 1 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 4
- Published applications
- 1
- Inventors
- 2
- Granted in 2026 so far
- 0
- Most recent grant
- 2 Dec 2003
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 1 |
| 2003 | 3 | 0 |
By publication year.
Technology areas
Share of 5 documents
Recent patents
- Top layers of metal for high performance IC's2 Dec 2003US 6,657,310 B2
- Structure of high performance combo chip and processing method2 Sep 2003US 6,613,606 B1
- Software programmable multiple function integrated circuit module29 Apr 2003US 6,555,398 B1
- Post passivation interconnection schemes on top of the IC chips17 Dec 2002US 6,495,442 B1
Most cited
By later US patents
- Post passivation interconnection schemes on top of the IC chips135US 6,495,442 B12002
- Top layers of metal for high performance IC's38US 6,657,310 B22003
- Structure of high performance combo chip and processing method33US 6,613,606 B12003
- Software programmable multiple function integrated circuit module4US 6,555,398 B12003