US 6,613,606 B1Granted

Structure of high performance combo chip and processing method

AssigneeMagic Corporation

InventorJin-Yuan Lee

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Abstract

A new method and package for the mounting of semiconductor devices. A silicon substrate serves as the device supporting medium, active semiconductor devices have been created in or on the surface of the silicon substrate. A solder plate is created over the surface of the substrate that aligns with the metal points of contact in the surface of the substrate. Semiconductor devices that have been provided with solder bumps or pin-grid arrays are connected to the solder plate. Underfill is applied to the connected semiconductor devices, the devices are covered with a layer of dielectric that is planarized. Inter-device vias are created in the layer of dielectric down to the surface of the substrate, re-routing interconnect lines are formed on the surface of the dielectric. Contact balls are connected to the re-routing lines after which the semiconductor devices that have been mounted above the silicon substrate are separated by die sawing. At this time, the separated semiconductor devices have two levels of ball interconnects, this can be further extended to for instance three levels of balls interconnect be connecting the second level of ball interconnect to a first surface of a Printed Circuit Board (PCB) while additional contact balls are connected to a second surface of this PCB.

Claims13

Dependent claims

A method of creating a circuit assembly, comprising the steps of:

providing a semiconductor substrate, having been provided with at least one active surface region wherein at least one semiconductor circuit has been created, with at least one first electrical point of contact having been provided in said at least one active surface region of said semiconductor substrate;
providing a first interface created overlying said surface of said semiconductor substrate comprising a first layer of dielectric having openings whereby at least one of said openings is filled with a conductive material that contacts at least one of said at least one electrical contacts provided in said surface of said semiconductor substrate, thereby creating second electrical contacts in the surface of said first interface;
providing at least one semiconductor die having been provided with active circuits, further having been provided with at least one first contact ball or contact point forming at least one third electrical contact;
providing electrical contact between at least one of said third electrical contacts of said at least one semiconductor die and at least one of said second electrical contacts;
providing an underfill for said at least one semiconductor die, curing said underfill;
depositing a second layer of dielectric over the surface of said at least one semiconductor die, planarizing said deposited second layer of dielectric;
creating at least one via opening penetrating said second layer of dielectric and said first layer of dielectric, exposing at least one of said first electrical contacts provided in said at least one active region in said surface of said semiconductor substrate;
depositing and patterning a first layer of conductive material over the surface of said second layer of dielectric, filling said at least one via opening created in said second layer and first layer of dielectric with a conductive material, further creating a first interconnect network over the surface of said second layer of dielectric, thereby contacting at least one of said at least one via openings created in said second layer of dielectric, thereby establishing electrical contact between said first interconnect network and at least one of said first electrical contacts in said at least one active region in the surface of said semiconductor substrate;
providing second contact balls with at least one of said second contact balls contacting said first interconnect network, thereby including at least one of said at least one vias;
and
separating said at least one semiconductor device from its surrounding region by die sawing said semiconductor substrate without affecting any interconnect metal that is connected to said at least one semiconductor device, creating an intermediate semiconductor package.

8 more elements

A method of forming a semiconductor device package for simultaneous packaging of more than one semiconductor device after which the semiconductor device package can be separated into individually packaged semiconductor devices, said method comprising the steps of:

providing a silicon substrate and at least one semiconductor device, said silicon substrate having at least one active surface area comprising active devices having points of electrical contact thereto, said at least one semiconductor device having been provided with points of electrical contact;
providing a first conductive interface between said at least one semiconductor device and said at least one active surface area in the surface of said silicon substrate, said first conductive interface comprising a first array of contact balls or contact pins;
mounting at least one semiconductor device over at least one active surface area provided in the surface of said silicon substrate;
providing underfill for said at least one semiconductor device;
depositing a layer of dielectric over said at least one semiconductor device, planarizing said layer of dielectric;
creating at least one via in said layer of dielectric and in said first interface, said at least one via exposing at least one contact point provided in said at least one active area in the surface of said silicon substrate;
creating a first network of interconnect lines on the surface of said layer of dielectric, said first network of interconnect lines contacting at least one of said contacts provided in said at least one active area in the surface of said silicon substrate through said at least one via created in said layer of dielectric;
attaching a second array of contact balls to said first network of interconnect lines including said at least one via created in said layer of dielectric and said first interface;
singulating said at least one semiconductor device by sawing said silicon substrate, creating at least one partially completed singulated semiconductor having at least one contact ball belonging to said second array of contact balls;
providing an interconnect substrate having a first surface and a second surface, at least one bonding pad having been provided in said second surface of said interconnect substrate, a third array of contact balls comprising at least one contact ball having been-provided in said first surface of said interconnect substrate;
connecting at least one of said at least one bonding pad in said second surface of said interconnect substrate with said at least one contact ball of said second array of contact balls;
and
providing an underfill for said at least one partially completed singulated semiconductor, completing the formation of said semiconductor device package.

10 more elements

Dependencies are inferred from the claim text.