Y10T 83/0581
Cutting part way through from opposite sides of work
Y10T83/0581 (Cutting part way through from opposite sides of work) appears on 116 US grants and 59 published applications in this corpus.
Search patents in Y10T- Granted patents
- 116
- Published applications
- 59
- Assignees
- 92
- Inventors
- 187
- Latest grant
- 12 Jul 2016
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 5 | 4 |
| 2002 | 5 | 3 |
| 2003 | 4 | 4 |
| 2004 | 7 | 11 |
| 2005 | 5 | 2 |
| 2006 | 7 | 5 |
| 2007 | 4 | 4 |
| 2008 | 3 | 6 |
| 2009 | 2 | 4 |
| 2010 | 4 | 0 |
| 2011 | 3 | 6 |
| 2012 | 2 | 4 |
| 2013 | 4 | 3 |
| 2014 | 5 | 2 |
| 2015 | 1 | 1 |
| 2016 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Receipt printer configurable for full or partial cut12 Jul 2016US 9,387,707 B2Toshiba Global Commerce Solutions Holdings Corporation
- Method for fabricating medical imaging multilayer, multiaperture collimator3 May 2016US 9,330,801 B2Siemens Medical Solutions USA, Inc.
- Multilayer, multiaperture collimator for medical imaging and fabrication method17 Feb 2015US 8,957,397 B2Siemens Medical Solutions USA, Inc.
- Blowout preventers for shearing a wellbore tubular13 May 2014US 8,720,567 B2National Oilwell Varco, L. P.
- Method for producing glass substrate for magnetic disk and method for producing magnetic disk6 May 2014US 8,715,777 B2Hoya Corporation
- Method For Fabricating Medical Imaging Multilayer, Multiaperture Collimator19 Mar 2015US 2015/0076375 A1Siemens Medical Solutions USA, Inc.
- Method and apparatus for substantially simultaneously scoring a workpiece from opposed sides18 Dec 2014US 2014/0366694 A1Oberg Industries
- Receipt printer configurable for full or partial cut3 Jul 2014US 2014/0186089 A1Toshiba Global Commerce Solutions Holdings Corporation
- Cutter22 Aug 2013US 2013/0213202 A1Vermont Instrument Makers
- Led wiring board and light irradiation apparatus27 Jun 2013US 2013/0163249 A1CCS Inc.
Most cited
By later US patents
- Method and system for dicing wafers, and semiconductor structures incorporating the products thereof63US 6,271,102 B1International Business Machines Corporation · 2001
- Blowout preventers and methods of use57US 7,367,396 B2Varco I/P, Inc. · 2008
- Elastomer sieve screen55US 4,832,834 A1989
- Method for dicing of micro devices44US 6,291,317 B1Xerox Corporation · 2001
- Blowout preventers and methods of use38US 7,814,979 B2National Oilwell Varoo, L.P. · 2010