Y10T 83/0524
Plural cutting steps
Y10T83/0524 (Plural cutting steps) appears on 891 US grants and 580 published applications in this corpus.
Search patents in Y10T- Granted patents
- 891
- Published applications
- 580
- Assignees
- 587
- Inventors
- 1,407
- Latest grant
- 28 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 15 | 0 |
| 1977 | 17 | 0 |
| 1978 | 5 | 0 |
| 1979 | 12 | 0 |
| 1980 | 13 | 0 |
| 1981 | 15 | 0 |
| 1982 | 19 | 0 |
| 1983 | 10 | 0 |
| 1984 | 15 | 0 |
| 1985 | 16 | 0 |
| 1986 | 13 | 0 |
| 1987 | 24 | 0 |
| 1988 | 22 | 0 |
| 1989 | 23 | 0 |
| 1990 | 12 | 0 |
| 1991 | 26 | 0 |
| 1992 | 23 | 0 |
| 1993 | 15 | 0 |
| 1994 | 23 | 0 |
| 1995 | 17 | 0 |
| 1996 | 16 | 0 |
| 1997 | 14 | 0 |
| 1998 | 19 | 0 |
| 1999 | 24 | 0 |
| 2000 | 23 | 0 |
| 2001 | 25 | 15 |
| 2002 | 21 | 38 |
| 2003 | 30 | 33 |
| 2004 | 22 | 34 |
| 2005 | 25 | 45 |
| 2006 | 31 | 44 |
| 2007 | 18 | 28 |
| 2008 | 20 | 34 |
| 2009 | 15 | 39 |
| 2010 | 26 | 47 |
| 2011 | 31 | 41 |
| 2012 | 26 | 32 |
| 2013 | 34 | 30 |
| 2014 | 31 | 38 |
| 2015 | 21 | 37 |
| 2016 | 26 | 11 |
| 2017 | 20 | 11 |
| 2018 | 9 | 5 |
| 2019 | 9 | 5 |
| 2020 | 8 | 4 |
| 2021 | 5 | 1 |
| 2022 | 4 | 1 |
| 2023 | 1 | 2 |
| 2024 | 1 | 2 |
| 2025 | 1 | 3 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Mechanical locking system for floor panels28 Jan 2025US 12,209,417 B2Ceraloc Innovation AB
- Negative pressure wound treatment apparatus22 Oct 2024US 12,121,417 B2Smith & Nephew, Inc.
- Mechanical locking system for floor panels16 May 2023US 11,649,642 B2Ceraloc Innovation AB
- Pre-cut infeed system28 Jun 2022US 11,370,141 B2Usnr, LLC
- Wound packing14 Jun 2022US 11,357,903 B2Smith & Nephew, Inc.
- Corner saw27 Nov 2025US 2025/0360655 A1Park Industries, Inc.
- Mechanical locking system for floor panels17 Jul 2025US 2025/0230670 A1Ceraloc Innovation AB
- Wound packing10 Apr 2025US 2025/0114246 A1Smith & Nephew, Inc.
- Corner saw24 Oct 2024US 2024/0351244 A1Park Industries, Inc.
- Methods and apparatus for cutting profiles1 Feb 2024US 2024/0033836 A1Seoul Laser Dieboard System Co., Ltd.
Most cited
By later US patents
- Method for sawing wafers employing multiple indexing techniques for multiple die dimensions289US 6,578,458 B1Micron Technology, Inc. · 2003
- Wound packing156US 8,791,316 B2Smith & Nephew, Inc. · 2014
- Interventional medical device component having an interrupted spiral section and method of making the same114US 7,708,704 B2Codman & Shurtleff, PC · 2010
- Apertured web for disposable body exudates absorbent garments and method for making same100US 6,117,524 AUni-Charm Corporation · 2000
- Ticket dispensing machine and method98US 4,716,799 ASyntech International, Inc. · 1988