Y10T 442/3455
Including particulate material other than fiber
Y10T442/3455 (Including particulate material other than fiber) appears on 24 US grants and 11 published applications in this corpus.
Search patents in Y10T- Granted patents
- 24
- Published applications
- 11
- Assignees
- 18
- Inventors
- 68
- Latest grant
- 17 Jul 2018
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 2 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 4 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Resin composition, prepreg and metal foil-clad laminate17 Jul 2018US 10,028,377 B2Mitsubishi Gas Chemical Company, Inc.
- Resin composition, prepreg and laminate17 Apr 2018US 9,944,787 B2Mitsubishi Gas Chemical Company, Inc.
- Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide11 Oct 2016US 9,468,097 B2Panasonic Intellectual Property Management Co., Ltd.
- Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting10 Dec 2013US 8,603,624 B2Panasonic Corporation
- Crosslinked elastic material formed from a linear block copolymer8 Jan 2013US 8,349,963 B2Kimberly-Clark Worldwide, Inc.
- Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide17 Dec 2015US 2015/0366056 A1Panasonic Intellectual Property Management Co., Ltd.
- Prepreg, metal-clad laminate, and printed wiring board1 Oct 2015US 2015/0282302 A1Panasonic Intellectual Property Management Co., Ltd.
- Multilayer sliding member and method for manufacturing multilayer sliding members6 Aug 2015US 2015/0219156 A1Oiles Corporation
- Resin composition, prepreg and laminate19 Feb 2015US 2015/0050472 A1Mitsubishi Gas Chemical Company, Inc.
- Resin composition, prepreg and metal foil-clad laminate18 Dec 2014US 2014/0370771 A1Mitsubishi Gas Chemical Company, Inc.
Most cited
By later US patents
- Heat-resistant composite material and method of making same56US 4,246,313 AOwens-Illinois, Inc. · 1981
- Highly thermal conductive and electrical insulating substrate32US 4,307,147 AShowa Denko K. K. · 1981
- Tear/puncture resistant semi-laminate material23US 6,242,371 B12001
- Tear/puncture resistant semi-laminate material22US 5,958,805 A1999
- Laminated material for the production of plain bearing elements21US 4,263,361 AGlyco-Metall-Werke Daelen & Loos GmbH · 1981