Prepreg, metal-clad laminate, and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTakashi HOSHI, Hiroharu INOUE, Takeshi KITAMURA
Life of this patent
Estimating the term…
Abstract
A prepreg containing: a resin composition; and a woven fabric base material. The resin composition contains: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic curing agent having a naphthalene skeleton; (B) a high molecular weight compound having at least structures represented by formulae (1) and (2 ) or at least a structure represented by the formula (2), no unsaturated bond between carbon atoms, and a weight-average molecular weight of 250,000 to 850,000; and (C) an inorganic filler. (C) The inorganic filler is subjected to surface treatment with a silane coupling agent represented by a formula (3).
Claims5
A prepreg comprising:
- a resin composition;
- and
- a woven fabric base material,
- the resin composition comprising:
- (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic curing agent having a naphthalene skeleton;
- (B) a high molecular weight compound having at least structures represented by formulae (1) and (2) or at least a structure represented by the formula (2), no unsaturated bond between carbon atoms, and a weight-average molecular weight of 250,000 to 850,000;
- and
- (C) an inorganic filler subjected to surface treatment with a silane coupling agent represented by a formula (3),
- wherein m and n satisfy the following formulae:
- m:n (molar ratio)=0:1to0.35:0.65;
- m+n=1;
- 0≦m≦0.35;
- and 0.65≦n≦1, and
- R1 is a hydrogen atom or a methyl group, and R2 is a hydrogen atom or an alkyl group.
- YSiX3 (3)
- wherein X is a methoxy group or an ethoxy group, and Y has a methacryl group, a glycidyl group, or an isocyanate group at a telininal of an aliphatic alkyl group having carbon atoms of 3 or more and 18 or less.
Dependencies are inferred from the claim text.