Y10T 428/12715
Next to group ib metal-base component
Official title: Next to Group IB metal-base component
Y10T428/12715 (Next to group ib metal-base component) appears on 310 US grants and 259 published applications in this corpus.
Search patents in Y10T- Granted patents
- 310
- Published applications
- 259
- Assignees
- 207
- Inventors
- 680
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 6 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 13 | 0 |
| 2001 | 16 | 7 |
| 2002 | 16 | 20 |
| 2003 | 12 | 28 |
| 2004 | 17 | 16 |
| 2005 | 12 | 14 |
| 2006 | 16 | 14 |
| 2007 | 6 | 10 |
| 2008 | 2 | 5 |
| 2009 | 5 | 19 |
| 2010 | 7 | 15 |
| 2011 | 7 | 12 |
| 2012 | 7 | 12 |
| 2013 | 17 | 10 |
| 2014 | 7 | 16 |
| 2015 | 9 | 20 |
| 2016 | 12 | 8 |
| 2017 | 5 | 3 |
| 2018 | 7 | 7 |
| 2019 | 7 | 4 |
| 2020 | 7 | 5 |
| 2021 | 6 | 2 |
| 2022 | 7 | 5 |
| 2023 | 2 | 4 |
| 2024 | 5 | 2 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structure containing Sn layer or Sn alloy layer6 Jan 2026US 12,519,071 B2Ishihara Chemical Co., Ltd.
- Composite metal foil20 May 2025US 12,305,309 B2Industrial Technology Research Institute
- Metal-coated liquid-crystal polymer film10 Sep 2024US 12,089,327 B2Kuraray Co., Ltd.
- Electrical connector16 Jul 2024US 12,036,628 B2Aptiv Technologies AG
- Roll-bonded laminate and method for producing the same4 Jun 2024US 11,999,131 B2Toyo Kohan Co.Ltd
- Method of manufacturing composite metal foil17 Jul 2025US 2025/0230569 A1Industrial Technology Research Institute
- Composite metal foil and method of manufacturing the same23 May 2024US 2024/0167185 A1Industrial Technology Research Institute
- Electronic component with high coplanarity and method of manufacturing the same28 Mar 2024US 2024/0105670 A1Cyntec Co., Ltd.
- Copper-Phosphorus-Tin Brazing Wire and Preparation Method Thereof21 Dec 2023US 2023/0405731 A1Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- Electrical connector24 Aug 2023US 2023/0264303 A1Aptiv Technologies AG
Most cited
By later US patents
- Tin whisker-free tin or tin alloy plated article and coating technique thereof72US 4,959,278 ANippon Mining Co., Ltd. · 1990
- Low toxicity corrosion resistant solder61US 4,778,733 AEngelhard Corporation · 1988
- Pb-free Sn-Ag-Cu ternary eutectic solder56US 5,527,628 AIowa State University Research Foudation, Inc. · 1996
- Surface treatment method of copperfoil53US 4,049,481 AMitsui-Anaconda Electro Copper Sheet Co., Ltd. · 1977
- Composite coating for electrical connectors48US 5,028,492 AOlin Corporation · 1991