Y10T 29/53022
With means to test work or product
Official title: with means to test work or product
Y10T29/53022 (With means to test work or product) appears on 528 US grants and 319 published applications in this corpus.
Search patents in Y10T- Granted patents
- 528
- Published applications
- 319
- Assignees
- 297
- Inventors
- 995
- Latest grant
- 27 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 8 | 0 |
| 1979 | 7 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 7 | 0 |
| 1985 | 4 | 0 |
| 1986 | 13 | 0 |
| 1987 | 9 | 0 |
| 1988 | 7 | 0 |
| 1989 | 10 | 0 |
| 1990 | 13 | 0 |
| 1991 | 8 | 0 |
| 1992 | 17 | 0 |
| 1993 | 12 | 0 |
| 1994 | 16 | 0 |
| 1995 | 12 | 0 |
| 1996 | 14 | 0 |
| 1997 | 12 | 0 |
| 1998 | 18 | 0 |
| 1999 | 13 | 0 |
| 2000 | 21 | 0 |
| 2001 | 15 | 12 |
| 2002 | 19 | 13 |
| 2003 | 12 | 13 |
| 2004 | 19 | 10 |
| 2005 | 7 | 17 |
| 2006 | 15 | 18 |
| 2007 | 7 | 11 |
| 2008 | 6 | 11 |
| 2009 | 8 | 16 |
| 2010 | 8 | 20 |
| 2011 | 23 | 36 |
| 2012 | 15 | 43 |
| 2013 | 29 | 27 |
| 2014 | 29 | 32 |
| 2015 | 24 | 19 |
| 2016 | 18 | 4 |
| 2017 | 11 | 6 |
| 2018 | 14 | 5 |
| 2019 | 6 | 2 |
| 2020 | 3 | 2 |
| 2021 | 1 | 1 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Fitting assembly evaluating apparatus and methods27 May 2025US RE50,444 E1Swagelok Company
- Wafer bonding method and wafer bonding apparatus8 Aug 2023US 11,721,662 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Magnetic circuit and method for use29 Mar 2022US 11,291,150 B2
- Unified energy and data transfer medium and related devices, systems and methods5 Oct 2021US 11,135,929 B2
- Bonding alignment tool24 Nov 2020US 10,847,490 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Flexible Electrical Energy Devices, Tanks and Related Systems and Methods27 Jan 2022US 2022/0024342 A1
- Wafer bonding method and wafer bonding apparatus18 Feb 2021US 2021/0050324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Magnetic circuit and method for use8 Oct 2020US 2020/0323113 A1
- Unified Energy and Data Transfer Medium and Related Devices, Systems and Methods5 Mar 2020US 2020/0075266 A1
- Bonding alignment tool12 Dec 2019US 2019/0378813 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Stand alone swage apparatus368US 6,012,216 AEthicon, Inc. · 2000
- High speed precision chuck assembly117US 4,066,943 AElectroglas, Inc. · 1978
- Printed circuit board testing device with foil adapter113US 5,399,982 AMania GmbH & Co. · 1995
- High speed precision chuck assembly112US 3,936,743 AElectroglas, Inc. · 1976
- Adapter arrangement for electrically connecting flat wire carriers99US 5,109,596 AMania GmbH & Co. · 1992