Y10T 29/4922
With molding of insulation
Official title: with molding of insulation
Y10T29/4922 (With molding of insulation) appears on 547 US grants and 342 published applications in this corpus.
Search patents in Y10T- Granted patents
- 547
- Published applications
- 342
- Assignees
- 280
- Inventors
- 860
- Latest grant
- 13 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 12 | 0 |
| 1990 | 10 | 0 |
| 1991 | 15 | 0 |
| 1992 | 8 | 0 |
| 1993 | 7 | 0 |
| 1994 | 13 | 0 |
| 1995 | 11 | 0 |
| 1996 | 12 | 0 |
| 1997 | 13 | 0 |
| 1998 | 16 | 0 |
| 1999 | 18 | 0 |
| 2000 | 16 | 0 |
| 2001 | 19 | 13 |
| 2002 | 16 | 18 |
| 2003 | 21 | 7 |
| 2004 | 12 | 16 |
| 2005 | 10 | 21 |
| 2006 | 24 | 27 |
| 2007 | 15 | 18 |
| 2008 | 21 | 24 |
| 2009 | 10 | 24 |
| 2010 | 23 | 15 |
| 2011 | 19 | 21 |
| 2012 | 22 | 15 |
| 2013 | 17 | 21 |
| 2014 | 22 | 26 |
| 2015 | 27 | 42 |
| 2016 | 25 | 6 |
| 2017 | 19 | 7 |
| 2018 | 4 | 7 |
| 2019 | 9 | 4 |
| 2020 | 9 | 2 |
| 2021 | 2 | 3 |
| 2022 | 1 | 0 |
| 2023 | 3 | 1 |
| 2024 | 3 | 2 |
| 2025 | 1 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Very high speed, high density electrical interconnection system with broadside subassemblies13 May 2025US 12,300,942 B2Amphenol Corporation
- High speed, high density electrical connector with shielded signal paths preliminary class31 Dec 2024US 12,184,012 B2Amphenol Corporation
- Electrode array assembly and method of making same30 Jan 2024US 11,883,647 B2Boston Scientific Neuromodulation Corporation
- Managed electrical connectivity systems2 Jan 2024US 11,862,912 B2CommScope Technologies LLC
- Distal connector assemblies for medical lead extensions22 Aug 2023US 11,735,876 B2Medtronic, Inc.
- Very high speed, high density electrical interconnection system with broadside subassemblies23 Oct 2025US 2025/0329967 A1Amphenol Corporation
- High speed, high density electrical connector with shielded signal paths1 May 2025US 2025/0141160 A1Amphenol Corporation
- High speed, high density electrical connector with shielded signal paths25 Jan 2024US 2024/0030660 A1Amphenol Corporation
- Very high speed, high density electrical interconnection system with broadside subassemblies11 Jan 2024US 2024/0014609 A1Amphenol Corporation
- Managed electrical connectivity systems13 Jul 2023US 2023/0223726 A1CommScope Technologies LLC
Most cited
By later US patents
- Lead body-to-connector transition zone323US 7,877,869 B2Medtronic, Inc. · 2011
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- High speed high density electrical connector246US 7,163,421 B1Amphenol Corporation · 2007
- Implantable lead and method of manufacture234US 6,216,045 B1Advanced Neuromodulation Systems, Inc. · 2001
- Feedthrough for electrical connectors233US 7,396,265 B2Cochlear Limited · 2008