Y10T 156/1082
Partial cutting bonded sandwich [e.g., grooving or incising]
Y10T156/1082 (Partial cutting bonded sandwich [e.g., grooving or incising]) appears on 990 US grants and 628 published applications in this corpus.
Search patents in Y10T- Granted patents
- 990
- Published applications
- 628
- Assignees
- 507
- Inventors
- 1,460
- Latest grant
- 16 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 10 | 0 |
| 1978 | 9 | 0 |
| 1979 | 8 | 0 |
| 1980 | 11 | 0 |
| 1981 | 7 | 0 |
| 1982 | 9 | 0 |
| 1983 | 5 | 0 |
| 1984 | 10 | 0 |
| 1985 | 19 | 0 |
| 1986 | 18 | 0 |
| 1987 | 9 | 0 |
| 1988 | 14 | 0 |
| 1989 | 20 | 0 |
| 1990 | 16 | 0 |
| 1991 | 11 | 0 |
| 1992 | 13 | 0 |
| 1993 | 16 | 0 |
| 1994 | 18 | 0 |
| 1995 | 18 | 0 |
| 1996 | 20 | 0 |
| 1997 | 24 | 0 |
| 1998 | 21 | 0 |
| 1999 | 32 | 0 |
| 2000 | 36 | 0 |
| 2001 | 25 | 9 |
| 2002 | 34 | 31 |
| 2003 | 42 | 43 |
| 2004 | 29 | 42 |
| 2005 | 23 | 36 |
| 2006 | 33 | 39 |
| 2007 | 27 | 23 |
| 2008 | 13 | 34 |
| 2009 | 18 | 39 |
| 2010 | 29 | 42 |
| 2011 | 42 | 43 |
| 2012 | 43 | 49 |
| 2013 | 45 | 39 |
| 2014 | 43 | 36 |
| 2015 | 34 | 43 |
| 2016 | 20 | 11 |
| 2017 | 22 | 11 |
| 2018 | 16 | 15 |
| 2019 | 13 | 7 |
| 2020 | 21 | 23 |
| 2021 | 12 | 5 |
| 2022 | 6 | 3 |
| 2023 | 5 | 1 |
| 2024 | 4 | 4 |
| 2025 | 5 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of manufacturing laminated armoring material16 Dec 2025US 12,496,804 B2Resonac Packaging Corporation
- Flexible packaging structure with built-in tamper-evidence features and method for making same14 Oct 2025US 12,441,047 B2TOPPAN Packaging Americas Holdings, Inc.
- Electronic device5 Aug 2025US 12,379,536 B2Innolux Corporation
- Die cut opening for multi-layer flexible package3 Jun 2025US 12,319,485 B2TOPPAN Packaging Americas Holdings, Inc.
- Transaction and ID cards having selected texture and coloring13 May 2025US 12,299,514 B2CompoSecure, LLC
- Transaction and id cards having selected texture and coloring5 Dec 2024US 2024/0403592 A1CompoSecure, LLC
- Method for manufacturing electronic device2 May 2024US 2024/0142671 A1Innolux Corporation
- Flexible packaging structure with built-in tamper-evidence features and method for making same18 Apr 2024US 2024/0123676 A1Sonoco Development, Inc.
- Method of manufacturing laminated armoring material14 Mar 2024US 2024/0083142 A1Resonac Packaging Corporation
- Flexible packaging structure with built-in tamper-evidence features and method for making same9 Feb 2023US 2023/0041551 A1Sonoco Development, Inc.
Most cited
By later US patents
- Method of fabricating thin film sensors2,095US 5,391,250 AMiniMed Inc. · 1995
- Process for producing an electrochemical biosensor1,891US 6,103,033 ATheraSense, Inc. · 2000
- Biosensor412US 6,004,441 AMatsushita Electric Industrial Co., Ltd. · 1999
- Method of making a transcutaneous electrochemical sensor374US 6,973,706 B2TheraSense, Inc. · 2005
- Method of making a multiwell test plate187US 4,948,442 APolyfiltronics, Inc. · 1990