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US 2024/0142671 A1Published application
Method for manufacturing electronic device
AssigneeInnolux Corporation
InventorsChi-Fang WU, Chin-Lung TING, I-Chang LIANG
Life of this patent
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Abstract
An electronic device includes: a first substrate; a second substrate, disposed opposite to the first substrate; an insulating layer, disposed on a surface of the first substrate away from the second substrate; and a metal layer, disposed on a surface of the second substrate away from the first substrate, wherein a width of the insulating layer is different from a width of the metal layer.
Claims7
An electronic device, comprising:
- a first substrate;
- a second substrate, disposed opposite to the first substrate;
- an insulating layer, disposed on a surface of the first substrate away from the second substrate;
- and
- a metal layer, disposed on a surface of the second substrate away from the first substrate,
- wherein a width of the insulating layer is different from a width of the metal layer.
3 more elements
Dependencies are inferred from the claim text.