Y10S 451/908
Electrical abrading
Y10S451/908 (Electrical abrading) appears on 19 US grants and 11 published applications in this corpus.
Search patents in Y10S- Granted patents
- 19
- Published applications
- 11
- Assignees
- 15
- Inventors
- 39
- Latest grant
- 7 Aug 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 3 |
| 2003 | 0 | 0 |
| 2004 | 4 | 4 |
| 2005 | 3 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Electron-beam-assisted EEM method7 Aug 2012US 8,235,769 B2JTEC Corporation
- Producing notch feature in small diameter steel alloy needle wire22 Sep 2009US 7,591,716 B2Ethicon Endo-Surgery, Inc.
- Abrading tool and method for refurbishing electrical connector pin contacts8 Apr 2008US 7,354,336 B1Pratt & Whitney Canada Corp.
- Sensor stripe encapsulation layer in a read/write head30 Aug 2005US 6,935,923 B2Seagate Technology LLC
- Conductive polishing pad with anode and cathode17 May 2005US 6,893,328 B2Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Electron-Beam-Assisted EEM Method2 Sep 2010US 2010/0221986 A1JTEC Corporation
- Abrading tool and method for refurbishing electrical connector pin contacts17 Apr 2008US 2008/0090494 A1Pratt & Whitney Canada Corp.
- Producing notch feature in small diameter steel alloy needle wire6 Dec 2007US 2007/0277363 A1Ethicon Endo-Surgery, Inc.
- Electro-chemical machining apparatus21 Apr 2005US 2005/0082165 A1
- Conductive polishing pad with anode and cathode28 Oct 2004US 2004/0214510 A1Rohm and Haas Electronic Materials CMP Holdings, Inc.
Most cited
By later US patents
- Apparatus and method for uniformly polishing a wafer118US 5,624,300 AFujitsu Limited · 1997
- Apparatus and method for uniformly polishing a wafer93US 5,562,529 AFujitsu Limited · 1996
- ELG for both MRE sensor height and resistance monitoring59US 6,347,983 B1Seagate Technology LLC · 2002
- Combination electrolytic polishing and abrasive super-finishing method49US 6,074,284 AUnique Technology International PTE. Ltd. · 2000
- Electro-chemical machining appartus40US 6,846,227 B2Sony Corporation · 2005