Y10S 428/929
Electrical contact feature
Y10S428/929 (Electrical contact feature) appears on 224 US grants and 70 published applications in this corpus.
Search patents in Y10S- Granted patents
- 224
- Published applications
- 70
- Assignees
- 135
- Inventors
- 433
- Latest grant
- 4 Jul 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 2 | 0 |
| 1981 | 7 | 0 |
| 1982 | 9 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 5 | 0 |
| 1986 | 8 | 0 |
| 1987 | 8 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 8 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 11 | 0 |
| 1998 | 4 | 0 |
| 1999 | 12 | 0 |
| 2000 | 8 | 0 |
| 2001 | 9 | 1 |
| 2002 | 10 | 5 |
| 2003 | 7 | 9 |
| 2004 | 6 | 4 |
| 2005 | 7 | 4 |
| 2006 | 3 | 5 |
| 2007 | 3 | 9 |
| 2008 | 0 | 6 |
| 2009 | 4 | 7 |
| 2010 | 7 | 3 |
| 2011 | 7 | 7 |
| 2012 | 5 | 4 |
| 2013 | 3 | 2 |
| 2014 | 5 | 1 |
| 2015 | 4 | 2 |
| 2016 | 0 | 0 |
| 2017 | 2 | 0 |
| 2018 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Coated articles and methods4 Jul 2017US 9,694,562 B2Xtalic Corporation
- Composite materials21 Mar 2017US 9,603,229 B2Hexcel Composites Limited
- Composite materials17 Mar 2015US 8,980,770 B2Hexcel Composites Limited
- Composite materials17 Mar 2015US 8,980,771 B2Hexcel Composites Limited
- Tin-plated copper-alloy material for terminal and method for producing the same27 Jan 2015US 8,940,404 B2Mitsubishi Materials Corporation
- Coated articles and methods1 Mar 2018US 2018/0056630 A1Xtalic Corporation
- Composite materials30 Jul 2015US 2015/0210039 A1Hexcel Composites Limited
- Composite materials4 Jun 2015US 2015/0156854 A1Hexcel Composites Limited
- Hybrid solder and filled paste in microelectronic packaging2 Oct 2014US 2014/0291843 A1Intel Corporation
- Coated articles and methods3 Oct 2013US 2013/0260176 A1Xtalic Corporation
Most cited
By later US patents
- Particle-enhanced joining of metal surfaces233US 5,083,697 A1992
- Mixed fiber composite structures high surface area-high conductivity mixtures94US 5,080,963 AAuburn University · 1992
- Electrical interconnect using particle enhanced joining of metal surfaces85US 5,642,055 AParticle Interconnect, Inc. · 1997
- Anisotropic-electroconductive adhesive film81US 4,731,282 AHitachi Chemical Company, Ltd. · 1988
- Electrical contact material and method for making the same56US 4,162,160 AFansteel Inc. · 1979