Y10S 29/90
Methods and apparatus for assembly by electrostatic attraction
Y10S29/90 (Methods and apparatus for assembly by electrostatic attraction) appears on 11 US grants and 6 published applications in this corpus.
Search patents in Y10S- Granted patents
- 11
- Published applications
- 6
- Assignees
- 9
- Inventors
- 21
- Latest grant
- 29 Jan 2013
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 3 |
| 2004 | 1 | 0 |
| 2005 | 1 | 0 |
| 2006 | 1 | 1 |
| 2007 | 1 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Adhesive chuck, and apparatus and method for assembling substrates using the same29 Jan 2013US 8,361,267 B2Advanced Display Process Engineering Co., Ltd.
- Adhesive chuck, and apparatus and method for assembling substrates using the same12 Apr 2011US 7,921,895 B2Advanced Display Process Engineering Co., Ltd.
- Method for assembling micro structures8 Apr 2008US 7,353,593 B2Simon Fraser University
- Throw-away burnishing tool for outside diameter and for inside diameter11 Sep 2007US 7,266,873 B2Sugino Machine Limited
- Method of manufacturing a micrometer-scaled electronic-charge-transferring device31 Jan 2006US 6,990,732 B2Hewlett-Packard Development Company, L. P.
- Adhesive chuck, and apparatus and method for assembling substrates using the same4 Aug 2011US 2011/0187063 A1Advanced Display Process Engineering Co., Ltd.
- Adhesive chuck, and apparatus and method for assembling substrates using the same13 Dec 2007US 2007/0285870 A1Advanced Display Process Engineering Co., Ltd.
- Throw-away burnishing tool for outside diameter and for inside diameter6 Jul 2006US 2006/0144198 A1Sugino Machine Limited
- Microfabricated Van De Graaf30 Oct 2003US 2003/0200651 A1Hewlett-Packard Development Company, L. P.
- Method for assembling micro structures and related apparatus16 Oct 2003US 2003/0192179 A1Simon Fraser University
Most cited
By later US patents
- Apparatus and method for removably adhering a semiconductor substrate to a substrate support18US 6,722,026 B1KLA-Tencor Corporation · 2004
- Apparatus and method for bonding sheet material and its application to manufacture of flexible flat cable9US 5,387,298 AFujikura Ltd. · 1995
- Method and apparatus for effecting interference fit of two parts by accelerating one of the parts8US 6,560,846 B1Toyota Jidosha Kabushiki Kaisha · 2003
- Apparatus and method for bonding sheet material and its application to manufacture of flexible flat cable7US 5,518,570 AFujikura Ltd. · 1996
- Throw-away burnishing tool for outside diameter and for inside diameter2US 7,266,873 B2Sugino Machine Limited · 2007