Y10S 29/029
Molding with other step
Y10S29/029 (Molding with other step) appears on 52 US grants and 14 published applications in this corpus.
Search patents in Y10S- Granted patents
- 52
- Published applications
- 14
- Assignees
- 32
- Inventors
- 88
- Latest grant
- 8 Jun 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 3 |
| 2002 | 1 | 3 |
| 2003 | 5 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Shaft assembly for an electrified vehicle and shaft providing method8 Jun 2021US 11,028,873 B2Ford Global Technologies, LLC
- Motor shaft assembly and assembling method with an insert that provides a fluid conduit16 Jul 2019US 10,352,351 B2Ford Global Technologies, LLC
- High density integrated circuit apparatus, test probe and methods of use thereof26 May 2009US 7,538,565 B1International Business Machines Corporation
- Constant velocity joint plunge boot16 Oct 2007US 7,282,166 B2GKN Driveline North America, Inc.
- Method of manufacturing commutator of rotary electric machine16 May 2006US 7,043,822 B2Denso Corporation
- Shaft assembly for an electrified vehicle and shaft providing method12 Sep 2019US 2019/0277332 A1Ford Global Technologies, LLC
- Motor shaft assembly and assembling method with an insert that provides a fluid conduit21 Jun 2018US 2018/0172063 A1Ford Global Technologies, LLC
- High density integrated circuit apparatus, test probe and methods of use thereof21 May 2009US 2009/0128176 A1
- High density integrated circuit apparatus, test probe and methods of use thereof29 May 2008US 2008/0121879 A1
- High density integrated circuit apparatus, test probe and methods of use thereof8 May 2008US 2008/0106291 A1
Most cited
By later US patents
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof284US 5,821,763 AInternational Business Machines Corporation · 1998
- Method of forming a three dimensional high performance interconnection package271US 5,531,022 AInternational Business Machines Corporation · 1996
- Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer256US 5,635,846 AInternational Business Machines Corporation · 1997
- Disposable-retractable finger stick device224US 5,133,730 AInternational Technidyne Corporation · 1992