H05K 7/20754
Air circulating in closed loop within cabinets
Official title: {Air circulating in closed loop within cabinets}
H05K7/20754 (Air circulating in closed loop within cabinets) appears on 210 US grants and 244 published applications in this corpus.
Search patents in H05K- Granted patents
- 210
- Published applications
- 244
- Assignees
- 103
- Inventors
- 411
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 2 |
| 2003 | 4 | 2 |
| 2004 | 1 | 4 |
| 2005 | 2 | 6 |
| 2006 | 1 | 0 |
| 2007 | 5 | 7 |
| 2008 | 7 | 20 |
| 2009 | 6 | 9 |
| 2010 | 6 | 5 |
| 2011 | 6 | 8 |
| 2012 | 8 | 15 |
| 2013 | 10 | 9 |
| 2014 | 9 | 19 |
| 2015 | 10 | 14 |
| 2016 | 14 | 9 |
| 2017 | 16 | 8 |
| 2018 | 14 | 12 |
| 2019 | 16 | 16 |
| 2020 | 12 | 14 |
| 2021 | 12 | 20 |
| 2022 | 15 | 10 |
| 2023 | 16 | 10 |
| 2024 | 8 | 8 |
| 2025 | 8 | 9 |
| 2026 | 3 | 8 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Data center15 Sep 2026US 12,740,019 B2Pripco Limited
- Data center with a switch cabinet row arranged in a container and a cold aisle-warm aisle partition8 Sep 2026US 12,733,135 B2Rittal GmbH & Co.KG
- System and method for optimized cooling and simplified handling of data processing equipment7 Jul 2026US 12,677,399 B2Orca Connex AS
- Rack-mountable heat-exchanger for modular electronic systems23 Dec 2025US 12,507,382 B2Cisco Technology, Inc.
- Server cooling using sprayed fluid and high conductivity gas or air18 Nov 2025US 12,477,685 B2Microsoft Technology Licensing, LLC
- Hardware security module appliance1 Oct 2026US 2026/0304709 A1Entrust Security UK Limited
- Rack mountable cooling systems and methods27 Aug 2026US 2026/0255526 A1Schroff GmbH
- Forward-mounted cpu for vertically mounted asic switch box21 May 2026US 2026/0140549 A1Nubis Communications, Inc.
- Door assembly for heat capture cabinet7 May 2026US 2026/0126237 A1Dell Products L. P.
- Thermal management of a distributed system2 Apr 2026US 2026/0096067 A1Dell Products L. P.
Most cited
By later US patents
- Method and apparatus for combined air and liquid cooling of stacked electronics components280US 6,775,137 B2International Business Machines Corporation · 2004
- Method, apparatus, and system for cooling electronic components156US 6,628,520 B2Hewlett-Packard Development Company, L. P. · 2003
- Method for combined air and liquid cooling of stacked electronics components154US 6,924,981 B2International Business Machines Corporation · 2005
- Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation145US 6,896,612 B1Sun Microsystems, Inc. · 2005
- Balanced chilled fluid cooling system for a data center in a shipping container132US 7,511,960 B2Sun Microsystems, Inc. · 2009