H05K 5/0091
Housing specially adapted for small components
Official title: {Housing specially adapted for small components (for resistors H01C; for capacitors H01G; for integrated circuits H10W99/00)}
H05K5/0091 (Housing specially adapted for small components) appears on 444 US grants and 310 published applications in this corpus.
Search patents in H05K- Granted patents
- 444
- Published applications
- 310
- Assignees
- 304
- Inventors
- 1,059
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 8 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 9 | 0 |
| 1986 | 5 | 0 |
| 1987 | 13 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 12 | 0 |
| 1991 | 21 | 0 |
| 1992 | 5 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 7 | 0 |
| 1998 | 17 | 0 |
| 1999 | 13 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 3 |
| 2002 | 2 | 6 |
| 2003 | 5 | 5 |
| 2004 | 6 | 7 |
| 2005 | 2 | 5 |
| 2006 | 2 | 0 |
| 2007 | 3 | 8 |
| 2008 | 3 | 4 |
| 2009 | 1 | 3 |
| 2010 | 5 | 8 |
| 2011 | 3 | 3 |
| 2012 | 6 | 5 |
| 2013 | 3 | 28 |
| 2014 | 9 | 13 |
| 2015 | 13 | 32 |
| 2016 | 20 | 18 |
| 2017 | 26 | 29 |
| 2018 | 23 | 21 |
| 2019 | 26 | 30 |
| 2020 | 25 | 17 |
| 2021 | 19 | 12 |
| 2022 | 16 | 16 |
| 2023 | 13 | 14 |
| 2024 | 19 | 14 |
| 2025 | 4 | 5 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor module, semiconductor device, and vehicle16 Jun 2026US 12,660,100 B2Fuji Electric Co., Ltd.
- Surge protective device assembly modules2 Jun 2026US 12,646,932 B2Raycap, S.A.
- External data storage device12 May 2026US 12,628,285 B2SK hynix Inc.
- Compression structures for IC packages19 Aug 2025US 12,394,731 B2Apple Inc.
- Electrical assembly13 May 2025US 12,296,765 B2Lear Corporation
- External data storage device17 Sep 2026US 2026/0282246 A1SK hynix Inc.
- Carbon fiber-embedded wearable devices3 Sep 2026US 2026/0259585 A1Oura Health Oy
- Adaptive compression fit for referred sensation wearable9 Jul 2026US 2026/0194982 A1Afference Inc.
- Captive object flexure mechanism8 Jan 2026US 2026/0013054 A1
- Protective enclosure for electronic circuits11 Dec 2025US 2025/0380366 A1Inventus Holdings, LLC
Most cited
By later US patents
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- High-density electronic modules--process and product299US 4,706,166 AIrvine Sensors Corporation · 1987
- Process for manufacturing transponders of small dimensions285US 5,895,235 AEM Microelectronic-Marin SA · 1999
- Compact circuit package having improved circuit connectors180US 4,218,724 A1980
- Packaging electrical components116US 5,365,403 AVLT, Inc. · 1994